Abstract
The galvanostatic technique on a laboratory scale has been shown to be a useful tool in detecting the presence of nodules on the cathode during copper electrodeposition by using the value of the starting electrolytic potential and by the presence of a cathodic polarization peak on the potential–time curve. Studying the morphology of the deposit with a scanning electron microscope at various magnifications confirmed the galvanostatic results. It is postulated that inappropriate concentrations and/or ratios of the additives (thiourea, gelatin and chloride ions) are associated with a certain current density that generates intergranular microcracks due to adsorption of the additives and leads to the formation of nodules at the macroscale.
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Lafront, AM., Veilleux, B. & Ghali, E. Galvanostatic and microscopic studies of nodulation during copper electrolysis. Journal of Applied Electrochemistry 32, 329–337 (2002). https://doi.org/10.1023/A:1015589725641
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DOI: https://doi.org/10.1023/A:1015589725641