Abstract
The kinetics and mechanisms of InSb, GaAs, InAs, and InAs<Sn> dissolution in H2O2–HBr mixtures were studied. The dissolution rate was determined as a function of solution composition, and the rate-limiting steps were identified. The dissolution process was shown to be diffusion-limited for all the materials studied, independent of solution composition. The composition range was determined in which H2O2–HBr solutions can be used for chemical polishing of InAs. Doping was shown to have a strong effect on the dissolution rate.
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Tomashik, Z.F., Kusyak, N.V. & Tomashik, V.N. Chemical Etching of InAs, InSb, and GaAs in H2O2–HBr Solutions. Inorganic Materials 38, 434–437 (2002). https://doi.org/10.1023/A:1015402501421
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DOI: https://doi.org/10.1023/A:1015402501421