Abstract
Solid-phase photoetching of copper surface with photosensitive polyvinyl chloride compositions was studied. The depth of the relief was determined as influenced by the nature of photosensitizers present in the composition and by the exposure time of the photosensitive layer.
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Anfinogenov, V.A., Sirotkina, E.E., Domina, N.G. et al. Photoetching of Copper Surface with Photosensitive Polymeric Coatings. Russian Journal of Applied Chemistry 74, 1947–1949 (2001). https://doi.org/10.1023/A:1014825618605
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DOI: https://doi.org/10.1023/A:1014825618605