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Effects of mode mix upon fracture behavior of a solder joint

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Abstract

Results of fracture experiments of brass/solder/brass sandwich CTS (Compact Tension-Shear) specimens are presented together with observations of the crack propagation behavior and the fractographs. The fracture behaviors of the interface crack are analyzed by the finite element method with a modified boundary layer formulation. Several fracture mechanisms and the corresponding criteria are examined. And the crack growth behavior and fracture toughness are predicted. As the results various crack growth procedures such as the crack jump to another interface on the opposite side, the nucleation of a new crack far from the initial crack front, and the asymmetric relation of fracture toughness versus mode mix J ∞ c−φ can be successfully explained. The fractographs, the crack growth behaviors, and stress-strain distribution along the interface are inter-related.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Chonnam National University Kwangju, 500-757, Republic of Korea (E-mail

    Ki-Ju Kang, Dong-Hak Kim & Seon-Ho Choi

Authors
  1. Ki-Ju Kang
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  2. Dong-Hak Kim
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  3. Seon-Ho Choi
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Kang, KJ., Kim, DH. & Choi, SH. Effects of mode mix upon fracture behavior of a solder joint. International Journal of Fracture 113, 195–212 (2002). https://doi.org/10.1023/A:1014264930542

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