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Effect of thermal cycling on the solder joints' reliability of ceramic ball grid array

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Journal of Materials Science Letters

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References

  1. J. S. Hwang, “Modern Solder Technology for Competitive Manufacturing” (McGraw-Hill, New York, 1996) p. 336.

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  2. J. H. Lau and Yi Hsin Pao, “Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch SMT Assemblies” p. 153.

  3. Hacke, Peterludcuig, UMI (1992) p. 1.

  4. L. H. John, “Ball Grid Array Technology,” 3rd ed. (McGraw-Hill, New York, 1995) p. 5.

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  5. W. D. Callister Jr, “Materials Science and Engineering, An Introduction” (John Wiley and Sons, New York) p. 208.

  6. V. Kerlins, in “ASM Handbook, Vol. 12: Fractography,” 9th ed. (1996) p. 12.

  7. H. D. Soloman, “Solder Joint Reliability: Theory and Applications” (Van Nostrand-Reinhold, New York) p. 406.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Alaska-Fairbanks, Fairbanks, AK 99775, USA

    G. Sarkar

  2. Nanyang Technological University, Nanyang Avenue, Singapore, 639798, Singapore

    P. H. Wee &  Masrena

  3. Gintic Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Singapore

    M. Kuo

  4. Ngee Ann Polytechnic, 535 Clementi Road, Singapore, 599489, Singapore

    S. N. Mukherjee

Authors
  1. G. Sarkar
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  2. P. H. Wee
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  3. Masrena
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  4. M. Kuo
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  5. S. N. Mukherjee
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Sarkar, G., Wee, P.H., Masrena et al. Effect of thermal cycling on the solder joints' reliability of ceramic ball grid array. Journal of Materials Science Letters 21, 61–63 (2002). https://doi.org/10.1023/A:1014246712655

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  • DOI: https://doi.org/10.1023/A:1014246712655

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