Abstract
This paper describes the thermal behaviour of blends of bisitaconimide (I) and bisnadimide (N) resins of similar structures. Bisitaconimides/bisnadimides based on 4,4'-diaminodiphenyl ether (E);2,2'-bis[4-(4-aminophenoxy)phenyl]propane (B); 1,3-bis(4-aminophenyl)benzene(R) and 1,4-bis(4-aminophenyl)benzene (H) were prepared and were designated as E-I/E-N; B-I/B-N; R-I/R-N and H-I/H-N respectively. Itaconimides had lower melting points and curing temperatures than that of corresponding nadimides. The blends of bisitaconimides and bisnadimides were prepared in the ratios of1:3, 1:1, 3:1 by solution mixing (chloroform/acetone). A decrease in the melting point and characteristic curing temperatures was observed in the blends. Thermal stability of cured resin blends was only marginally affected by the blend composition.
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A. Mathur and I. K. Varma, Angew. Makromol. Chem., 206 (1993) 53.
I. K. Varma and H. P. Mittal, Thermochim. Acta, 144 (1989) 33.
I. K. Varma and R. Tewari, J. Thermal Anal., 32 (1987) 1023.
R. W. Lauver, J. Polym. Sci., 17 (1979) 2529.
S. L. Hartford, S. Subramanian and J. A. Parker, J. Polym. Sci., Polym. Chem. Ed., 16 (1978) 137.
K. V. C. Rao, T. M. Vijayan, M. M. S. Bisht and S. K. Nema, Development of Bisitaconimide Resins, Polymers and Composites, Recent trends; Oxford and IBH publication company, 1989, p. 155.
A. Solanki, V. Choudhary and I. K. Varma, Proceedings, Thermophysical Properties of Materials-An International Conf., Singapore, Nov. 1999, p. 217.
G. Odian, In Handbook of Principles of Polymerization, John Wiley & Sons, 1991, p. 261.
J. A. Brydson, Plastic Materials, Seventh edition, Butterworth-Heinemann, 1999, p. 696.
N. Gupta and I. K. Varma, J. Appl. Polym. Sci., 68 (1998) 1759.
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Solanki, A., Choudhary, V. & Varma, I.K. Thermal Behaviour of Bisitaconimide and Bisnadimide Blends. Journal of Thermal Analysis and Calorimetry 66, 749–758 (2001). https://doi.org/10.1023/A:1013187904548
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DOI: https://doi.org/10.1023/A:1013187904548