Abstract
Co-Al-O film was fabricated using the reactive r.f. magnetron sputtering technique. A maximum magnetoresistance (MR) of approximately 7% was established through optimizing the sputter deposition conditions such as sputter power and gas flow rate. TEM characterization of the film revealed a nano-granular structure that consisted of ferromagnetic grains with grain diameters on the order of several nm together with non-magnetic grain boundary layers with the thickness on the order of less than 1 nm. The large MR was attributed to electron tunneling thorough this very thin grain boundary layer between individual ferromagnetic grains.
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Kamei, K., Yonemura, M. & Hanafusa, K. TEM characterization of Co-Al-O nano-granular TMR film. Journal of Materials Science: Materials in Electronics 12, 569–574 (2001). https://doi.org/10.1023/A:1012489503146
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DOI: https://doi.org/10.1023/A:1012489503146