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Debonding of a Weak Interface in Front of a Through-Thickness Crack

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Abstract

A through thickness crack traversing a laminate and approaching an interface weakened by the presence of a small debonding defect is analysed in the case when the defect is fully embedded in the K-field of the main crack. Plane approximation estimates of critical interfacial strength for crack deflection are compared with 3D calculations using integral equation and weight function formulations.

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Authors and Affiliations

  1. Department of Engineering Science, University of Oxford, Parks Road, Oxford, OX1 3PJ, England

    Alexander M. Korsunsky

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  1. Alexander M. Korsunsky
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Korsunsky, A.M. Debonding of a Weak Interface in Front of a Through-Thickness Crack. International Journal of Fracture 109, 35–40 (2001). https://doi.org/10.1023/A:1012267014829

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  • DOI: https://doi.org/10.1023/A:1012267014829

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