Skip to main content
SpringerLink
Log in

DSC and FTIR Analyses of The Curing Behavior of Epoxy/dicy/solvent Systems on Hermetic Specimens

  • Published:
Journal of Thermal Analysis and Calorimetry Aims and scope Submit manuscript

Abstract

The curing characteristics of adicyandiamide-cured epoxy system under the influence of solvents in a closed environment were studied by means of isothermal differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy (FTIR). The DSC analyses revealed that the presence of solvent results in decreases in the curing exotherm, the initial curing rate, the glass transition temperature, the reaction rate and the reaction order of the epoxy resin. The greatest decreases were caused by the solvent with the highest boiling temperature. A change in temperature-dependent curing route due to the heat absorbed during solvent evaporation is responsible for the difference. The FTIR analyses confirmed that the composition of the cured resin is affected by the solvent, the curing temperature and the specimen configuration. As compared with those obtained from open systems, specimens produced in a closed environment have an enhanced curing exotherm, initial curing rate, glass transition temperature, reaction rate and reaction order because of the retention of volatile catalytic by-products.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. E. Sacher, Polymer, 14 (1973) 91.

    Article  CAS  Google Scholar 

  2. S. Muroi, H. Ishimura and M. Outsuka, J. Appl. Polym. Sci., 32 (1986) 5095.

    Article  CAS  Google Scholar 

  3. R. L. Miller and M. A. Oebser, Thermochim. Acta, 36 (1980) 121.

    Article  CAS  Google Scholar 

  4. P. N. Son and C. D. Weber, J. Appl. Polym. Sci., 17 (1973) 1305.

    Article  CAS  Google Scholar 

  5. J. M. Barton and D. C. Greenfield, Brit. Polym. J., 18 (1986) 196.

    CAS  Google Scholar 

  6. Y. G. Lin, H. Sautereau and J. P. Pascault, J. Polym. Sci., Part A, 24 (1986) 2171.

    CAS  Google Scholar 

  7. T. Guthner and B. Hammer, J. Appl. Polym. Sci., 50 (1993) 1453.

    Article  Google Scholar 

  8. M.-F. Grenier-Loustalot, M.-P. Bente and P. Grenier, Eur. Polym. J., 27 (1991) 1201.

    Article  CAS  Google Scholar 

  9. M. D. Gilbert, N. S. Schneider and W. J. MacKnight, Macromolecules, 24 (1991) 360.

    Article  CAS  Google Scholar 

  10. M. Opresnik, A. Sebenik, M. Zigon and U. Osredkar, Thermochim. Acta, 178 (1991) 127.

    Article  CAS  Google Scholar 

  11. S. G. Hong and T. C. Wang, Thermochim. Acta, 237 (1994) 305.

    Article  CAS  Google Scholar 

  12. S. G. Hong and J. J. Lin, J. Appl. Polym. Sci., 59 (1996) 1597.

    Article  CAS  Google Scholar 

  13. R. O. Cater III, R. A. Dickie, J. W. Holubka and N. E. Lindsay, Ind. Eng. Chem. Res., 28 (1989) 48.

    Article  Google Scholar 

  14. R. O. Cater III, R. A. Dickie and J. W. Holubka, Polym. Mat. Sci. Eng., 58 (1988) 55.

    Google Scholar 

  15. W. Brockmann, O. D. Hennemann, H. Kollek and C. Matz, Int. J. Adhes. Adhesives, 6 (1986) 115.

    Article  CAS  Google Scholar 

  16. F. J. Boerio and P. P. Hong, Mat. Sci. Eng., A126 (1990) 245.

    CAS  Google Scholar 

  17. G. L. Hagnauer and D. A. Dunn, J. Appl. Polym. Sci., 26 (1981) 1837.

    Article  CAS  Google Scholar 

  18. H. Inoue, H. Fukke, M. Katsumoto and K. Konno, J. Colloid Interface Sci., 138 (1990) 92.

    Article  CAS  Google Scholar 

  19. M. Shimbo, M. Ochi and K. Arai, J. Coating Technol., 57 (1985) 93.

    CAS  Google Scholar 

  20. S. G. Croll, J. Coating Technol., 51 (1979) 49.

    CAS  Google Scholar 

  21. S. G. Croll, J. Coating Technol., 53 (1981) 85.

    CAS  Google Scholar 

  22. S. G. Hong and C. S. Wu, Thermochim. Acta, in press, 1998.

  23. R. A. Fava, Polymer, 9 (1968) 137.

    Article  CAS  Google Scholar 

  24. G. L. Hagnauer and D. A. Dunn, J. Appl. Polym. Sci., 26 (1981) 1837.

    Article  CAS  Google Scholar 

  25. B. C. Ennis, R. G. Davidson, P. J. Pearce and C. E. M. Morris, J. Adhesion, 37 (1992) 131.

    CAS  Google Scholar 

  26. T. F. Saunders, M. F. Levy and J. F. Serino, J. Polym. Sci., Part A-1, 5 (1967) 1609.

    CAS  Google Scholar 

  27. P. Peyser and W. D. Bascom, J. Appl. Polym. Sci., 21 (1977) 2359.

    Article  CAS  Google Scholar 

  28. Y. G. Lin, H. Sautereau and J. P. Pascault, J. Polym. Sci., Part A, 24 (1986) 2171.

    CAS  Google Scholar 

  29. M. D. Gilbert, N. S. Schneider and W. J. MacKnight, Macromolecules, 24 (1991) 360.

    Article  CAS  Google Scholar 

  30. P. Eyerer, J. Appl. Polym. Sci., 15 (1971) 3067.

    Article  CAS  Google Scholar 

  31. H. H. Levine, Polym. Preprint, 41 (1964) 8.

    Google Scholar 

  32. R. O. Cater III, R. A. Dickie, J. W. Holubka and N. E. Lindsay, Ind. Eng. Chem. Res., 28 (1989) 48.

    Article  Google Scholar 

  33. W. J. Jones and W. J. Orville-Thomas, Trans. Faraday Soc., 55 (1959) 193.

    Article  CAS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Chemical Engineering, Yuan-Ze University, Nei-Li, Chung-Li, 320, Taiwan

    S.-G. Hong & C.-S. Wu

Authors
  1. S.-G. Hong
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. C.-S. Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

About this article

Cite this article

Hong, SG., Wu, CS. DSC and FTIR Analyses of The Curing Behavior of Epoxy/dicy/solvent Systems on Hermetic Specimens. Journal of Thermal Analysis and Calorimetry 59, 711–719 (2000). https://doi.org/10.1023/A:1010189301221

Download citation

  • Issue Date:

  • DOI: https://doi.org/10.1023/A:1010189301221

Search

Navigation