Abstract
DSC, TGA and DMA thermal analysis techniques are used to characterize a complex adhesive blend. The chemical and thermomechanical property development shown to follow a two-stage process. Beneficial synergy between these analysis tools is demonstrated in this study.
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Tabaddor, P.L., Aloisio, C.J., Bair, H.E. et al. Thermal Analysis Characterization of a Commercial Thermoplastic/Thermoset Adhesive. Journal of Thermal Analysis and Calorimetry 59, 559–570 (2000). https://doi.org/10.1023/A:1010166230313
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DOI: https://doi.org/10.1023/A:1010166230313