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Integrated circuit thermal analysis: A new thermal technique for polymer characterization

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Abstract

Polymer characterization has largely helped in the development of thermal analyzers and calorimeters, based mainly on the thermocouple technology, or more recently the semiconductor technology. With the use of an integrated silicon thermopile as a detector, a new thermal technique is appearing, to give more possibilities of investigations in the field of polymeric materials. Combining high sensitivity and use of small amount of sample, the originality of the new design comes from its low power consumption, giving rise to a portable version of the instrument. With such a concept, the thermal analysis technique is carried on the industrial site, to perform online measurements.

Melting and crystallization, glass transition, control of reticulation are a promising field of applications for the characterization of polymeric materials on industrial sites.

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References

  1. R. C. Mackenzie, Differential Thermal Analysis, Academic Press, USA 1970.

    Google Scholar 

  2. W. W. Wendlandt, Thermal Analysis 3rd ed., John Wiley and Sons, USA 1986.

    Google Scholar 

  3. E. A. Turi, Thermal Characterization of Polymeric Materials 2nd ed., Academic Press, USA 1997.

    Google Scholar 

  4. B. Wunderlich, Thermal Analysis, Academic Press, USA 1990.

    Google Scholar 

  5. E. L. Charsley and S. B. Warrington, Thermal Analysis: Techniques and Applications, Royal Society of Chemistry, UK 1991.

    Google Scholar 

  6. M. E. Brown, Introduction of Thermal Analysis, Chapman and Hall, USA 1988.

    Google Scholar 

  7. L. Benoist, Thermochim. Acta, 163 (1990) 111.

    Google Scholar 

  8. A. Villard and P. Le Parlouër, 24th NATAS Conference, San Francisco, USA 1995, 381.

  9. J. Lerchner, R. Oehmgen, G. Wolf, P. Le Parlouër and J. L. Daudon, High Temperatures, High Pressures, to be published.

  10. L. Benoist, J. L. Daudon, P. Le Parlouër, 12th Ulmer Freiberger Kalorimetrie Konferenz, Freiberg (Germany), March 1997.

  11. C. Mathonat, G. Bourdin, C. Parazza, J. L. Daudon and P. Le Parlouër, 26th NATAS Conference, Cleveland (USA), 1998, 570.

  12. R. P. Chartoff in Thermal Characterization of Polymeric Materials 2nd ed. (E. A. Turi), Academic Press, 1997, 510.

  13. Id. pp 594-614.

  14. R. B. Prime in Thermal Characterization of Polymeric Materials 2nd ed. (E. A. Turi), Academic Press, 1997, 1380.

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Correspondence to L. Benoist.

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Benoist, L., Le Parlouër, P. Integrated circuit thermal analysis: A new thermal technique for polymer characterization. Journal of Thermal Analysis and Calorimetry 59, 351–358 (2000). https://doi.org/10.1023/A:1010121020318

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  • DOI: https://doi.org/10.1023/A:1010121020318

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