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Direct-Write Fabrication of Integrated, Multilayer Ceramic Components

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Abstract

The need for advanced electronic ceramic components with smaller size, greater functionality and enhanced reliability requires the ability to integrate electronic ceramics in complex 3-D architectures. However, traditional tape casting and screen printing approaches are poorly suited to the requirements of rapid prototyping and small-lot manufacturing. To address this need, a direct-write approach for fabricating highly integrated, multilayer components using a Micropen to deposit slurries in precise patterns is being developed at Sandia. This approach provides the ability to fabricate multifunctional, multimaterial integrated ceramic components (MMICCs) in an agile and rapid way. Commercial ceramic thick-film pastes can be used directly in the system, as can polymer thick-film pastes (PTF). The quality of printed components depends on both the rheology and drying behavior of the pastes. Pastes with highly volatile solvents are inappropriate for the Micropen. This system has been used to make integrated passive devices such as RC filters, inductors, and voltage transformers.

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Authors and Affiliations

  1. Sandia National Laboratories, Albuquerque, NM, 87185

    B. H. King, D. Dimos, P. Yang & S. L. Morissette

Authors
  1. B. H. King
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  2. D. Dimos
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  3. P. Yang
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  4. S. L. Morissette
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King, B.H., Dimos, D., Yang, P. et al. Direct-Write Fabrication of Integrated, Multilayer Ceramic Components. Journal of Electroceramics 3, 173–178 (1999). https://doi.org/10.1023/A:1009999227894

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  • DOI: https://doi.org/10.1023/A:1009999227894

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