Abstract
The effects of process parameters such as flux, dipping temperature and the heat-treatment on the soldering behaviors of the eutectic solder (composition: 91Sn-9Zn) hot-dipped on Cu substrates were investigated. The most suitable flux as tested was oleic acid for the eutectic Sn-Zn solder system hot-dipped on Cu substrate for the solder coverage. The adhesion strength obtained increased from 9.6±0.6 MPa to 11.9±0.6 MPa when the dipping temperature increased from 250 °C to 300 °C. However, it decreased from 11.9±0.6 MPa to 5.2±2.2 MPa as the sample was heated at 150 °C for 1200 h. Planar γ-Cu5Zn8 isolate-shaped η-Cu6Sn5 intermetallic layers were found in the bulk sample after heating at 150 °C for 300 h but was not found in the as-cast sample. In the plate samples, scallop-shaped γ-Cu5Zn8/inverted trigonal-shaped η-Cu6Sn5 intermetallic layers were found after heating at 150 °C for 600 h. Some pores were found at the interface between γ-Cu5Zn8 intermetallic compound (IMC) and the solder alloy, which might come from the formation and growth of IMCs and decreased the adhesion strength. © 2000 Kluwer Academic Publishers
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Yu, SP., Lin, HJ., Hon, MH. et al. Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate. Journal of Materials Science: Materials in Electronics 11, 461–471 (2000). https://doi.org/10.1023/A:1008960316695
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DOI: https://doi.org/10.1023/A:1008960316695