Fabrication of a fully integrated passive module for filter application using MCM-D compatible processes

Abstract

Integral passive is an emerging technology which is currently perceived as a possible alternative to the discrete passive technology in fulfilling the next generation packaging needs. Although discrete surface mount passive components (resistors, capacitors, and inductors) have been well characterized, the development of integral passive components suitable for co-integration on the board level is relatively recent. Since in some applications the number of passive components can exceed the number and the area of IC chips on a circuit board or in a package, such integration of passive components would be necessary to substantially eliminate part count and reduce device area. To address these issues, integration technology for passive elements in the same manner as for transistors is necessary. In addition, the fabrication sequence of all integral passive components should be mutually compatible for co-integration on the same substrate. In this paper, materials and fabrication issues for passive elements such as resistors (R), capacitors (C), and inductors (L) and the feasibility of integration of these fabricated passive components on glass substrates have been addressed. An active filter circuit has been selected for a case study for R, L, and C co-integration. This passive module contains eleven resistors, four capacitors, and four inductors, and is fabricated using MCM-D (multichip module-deposited) compatible processes. A variety of materials appropriate for fabrication of integral passives in a mutually compatible fashion were investigated, including chromium and nickel-chromium resistors, composites of high dielectric constant materials in epoxies for capacitor dielectrics, and composites of magnetic ferrite particles in polyimides for inductor core and shielding. The fabricated devices showed good agreement between the design values and the corresponding measured values. It is anticipated that some of these materials and fabrication processes can be implemented for the MCM-L (multichip module-laminate) compatible packaging. © 2000 Kluwer Academic Publishers