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RuO2/Ru electrode on Si3N4/Si substrate for microelectromechanical systems devices based on Pb(Zr1-xTix)O3 film and surface micromachining

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Abstract

RuO2/Ru conducting films were deposited on low stress Si3N4/Si substrates by reactive r.f. sputtering deposition at a substrate temperature of 400°C to introduce a new bottom electrode for microelectromechanical system devices based on a Pb(Zr1-xTix)O3 film and a surface micromachining technique with high temperature processes. X-ray diffraction and scanning electron microscopy measurements after heat treatment at 700°C were conducted to investigate structural stability of the RuO2/Ru films, which showed no silicide and silicon oxide formations by the heat treatment. Interfacial structures of the film with the heat treatment were similar to those of the as-deposited films. The surface of the film with the heat treatment consisted of larger grains than those of the as-deposited film. Rutherford backscattering spectrometry and Auger electron spectroscopy showed no interfacial reactions between the RuO2/Ru and the Si3N4. In order to investigate the feasibility of the RuO2/Ru as a bottom electrode, Pb(Zr0.53Ti0.47)O3 films were deposited by metalorganic decomposition. After deposition of a Pb(Zr0.53Ti0.47)O3 film at 700°C for 30 min, the interface structure between the RuO2/Ru and the Pb(Zr0.53Ti0.47)O3 film showed no interface reactions. The electrical properties of the PZT film on the RuO2/Ru were not changed before and after an HF etching to make an air gap, even though the piezoelectric coefficients on the RuO2/Ru were lower than on the Pt/Ti. Therefore, the RuO2/Ru conducting film could be used for a bottom electrode on the Si3N4/Si for a microelectromechanical system device based on a Pb(Zr1-xTix)O3 film and a surface micromachining technique with high temperature processes.

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Authors
  1. Y. S. Yoon
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  2. J. H. Kim
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  3. A. M. Schimidt
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  4. D. L. Polla
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  5. Q. Wang
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  6. W. L. Gladfelter
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  7. Y. H. Shin
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Yoon, Y.S., Kim, J.H., Schimidt, A.M. et al. RuO2/Ru electrode on Si3N4/Si substrate for microelectromechanical systems devices based on Pb(Zr1-xTix)O3 film and surface micromachining. Journal of Materials Science: Materials in Electronics 9, 465–471 (1998). https://doi.org/10.1023/A:1008910326521

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