Abstract
Interfaces of solid state bonded Si3N4ceramics with Fe and Fe-(5, 10, 15 wt%)Cr alloy interlayers inArgon for 1 h at 1100°, 1200° and 1300°C have beencharacterized by electron probe microanalysis (EPMA) and transmissionelectron microscopy (TEM). Smooth interfaces with no evidence ofreactions products resulted when bonding at 1100°C. However, theinteraction between the ceramic and the metal increased at higherbonding temperatures and Cr-contents. In all samples Si and N fromthe ceramic dissolve and diffuse in the metal interlayer, whereas thesintering additives of the ceramic remain inactive.
Low Cr-content (≤5%) interlayers resulted in the formationof an interfacial zone composed of two sublayer structures; adjacentto the ceramic was a thin one containing the sintering aids ofSi3N4 and fine precipitates of Fe3Si and γ′-Fe4N in a bcc-Fe matrix. The second was thicker and includedfine Fe3Si,γ′-Fe4N andε-Fe2N precipitates in abcc-Fe matrix. The bond region with high Cr-content interlayersincluded three sublayer structures. The first one next to the ceramicwas a bcc-Fe matrix containing sintering aids, fine dispersedFe3Si andγ′-Fe4N, and CrN. The secondsublayer was similar but without any segregants from the ceramic. Thethird one, finally had a lamellae structure of Cr2N/bcc-Fe and the Fe matrix contained alsoγ′-Fe4N.
The interactionbetween the ceramic and the metal interlayer is believed to becontrolled by the solution rate of N in the alloy foils.
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Peteves, S.D., Suganuma, K. Interface Microstructures of Si3N4/Fe and Fe-Cr Alloys Joints. Interface Science 5, 63–72 (1997). https://doi.org/10.1023/A:1008602711873
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DOI: https://doi.org/10.1023/A:1008602711873