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Diagnostics in Disassembly Unscrewing Operations

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Abstract

Disassembly for recycling purposes is an emerging area of research that offers many advantages over more traditional means of recycling. However, many technical challenges are involved in automated disassembly. This paper addresses one of the critical challenges involved: diagnostics in the unscrewing operation. The various conditions that can arise when one attempts to unscrew a screw (one of which is the successful removal of the screw) are categorized, and a diagnostic procedure for detecting which condition has occurred and deciding what subsequent action to take is developed. Experimental condition detection results are presented.

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References

  • Boothroyd, G. and Alting, L., “Design for Assembly and Disassembly,” CIRP Annals, Vol. 41, No. 2, pp. 1-12 (1992).

    Google Scholar 

  • Dario, P., Rucci, M., Guadagnini, C., and Laschi, C., “An Investigation on a Robot System for Disassembly Automation,” Proceedings of the 1994 IEEE International Conference on Robotics and Automation, pp. 3515- 3521 (1994).

  • de Ron, A. and Penev, K., “Disassembly and Recycling of Electronic Consumer Products: An Overview,” Technovation, Vol. 15, No. 6, pp. 363-374 (1995).

    Article  Google Scholar 

  • Dutta, D. and Woo, T.C., “Algorithm for Multiple Disassembly and Parallel Assemblies,” ASME Journal of Engineering for Industry, Vol. 117, No. 1, pp. 102-109 (1995).

    Google Scholar 

  • Feldmann, K. and Scheller, H., “Disassembly of Electronic Products,” Proceedings of the 1994 IEEE International Symposium on Electronics and the Environment, pp. 81-86 (1994).

  • Golub, G.H. and Van Loan, C.F., Matrix Computations, 2nd ed., Johns Hopkins University Press, Baltimore (1990).

    Google Scholar 

  • Hentschel, C., Seliger, G., and Zussman, E., “Recycling Process Planning for Discarded Complex Products: A Predictive and Reactive Approach,” Proceedings of the Second International Seminar on Life Cycle Engineering, Erlangen, Germany, pp. 195-209 (October 1994).

    Google Scholar 

  • Hentschel, C., Seliger, G., and Zussman, E., “Grouping of Used Products for Cellular Recycling Systems,” CIRP Annals-Manufacturing Technology, Vol. 44, No. 1, pp. 11-14 (1995).

    Google Scholar 

  • Jorgensen, T., Andersen, A., and Christensen, S., “Shape Recognition System for Automatic Disassembly of TV Sets,” Proceedings of the 1996 IEEE International Conference on Image Processing, pp. 653-656 (1996).

  • Juvinal, R.C., Fundamentals of Machine Component Design, John Wiley and Sons, New York (1983).

    Google Scholar 

  • Kopacek, P. and Kronreif, G., “Semi-Automated Robotized Disassembling of Personal Computers,” Proceedings of the IEEE Symposium on Emerging Technologies and Factory Automation, pp. 567-572 (1996).

  • Langerak, E., “To Shred or Disassemble? Recycling of Plastics in Mass Consumer Goods,” Proceedings of the 1997 IEEE International Symposium on Electronics and the Environment, pp. 63-68 (1997).

  • Navin-Chandra, D., “Design for Environmentability,” Third International Conference on Design Theory and Methodology, ASME Design Engineering Division, Vol. DE-31, pp. 119-125 (September 1991).

    Google Scholar 

  • Pearson, E. and Hartley, H., eds., Biometrika Tables for Statisticians, Vol. 2, Cambridge University Press, London, England (1972).

    Google Scholar 

  • Rao, C.R., Linear Statistical Inference and its Applications, 2nd ed., John Wiley and Sons, New York (1973).

    Google Scholar 

  • Ray, L., “Robot Disassembles Explosive Devices,” Industrial Robot, Vol. 23, No. 3, pp. 20-24 (1996).

    Article  Google Scholar 

  • Seliger, G., Hentschel, C., and Kriwet, A., “Recycling and Disassembly-Legal Burden or Strategic Opportunity?” Proceedings of the Second Workshop of Assembly Automation and Future Outlook of Production Systems, Tokyo, pp. 89-95 (November 1993).

  • Seliger, G. and Hentschel, C., “Disassembly Process Planning to Support the Recyclability of Used Technical Products,” Proceedings of the Vision EUREKA Conference: Industrial Opportunities in Waste Management, Lillehammer, Norway, pp. 194-201 (June 1994).

  • Weigl, A., “Requirements for Robot Assisted Disassembly of Not Appropriately Designed Electronic Products: Lessons from First Studies,” Proceedings of the 1994 IEEE International Symposium on Electronics and the Environment, pp. 337-342 (1994).

  • Zussman, E., Kriwet, A., and Seliger, G., “Disassembly-Oriented Assessment Methodology to Support Design for Recycling,” CIRP Annals, Vol. 43, No. 1, pp. 9-14 (1994).

    Google Scholar 

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Apley, D.W., Seliger, G., Voit, L. et al. Diagnostics in Disassembly Unscrewing Operations. International Journal of Flexible Manufacturing Systems 10, 111–128 (1998). https://doi.org/10.1023/A:1008089230047

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  • DOI: https://doi.org/10.1023/A:1008089230047

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