Abstract
The effect of Au coating on thermally induced stresses in box-type semiconductor laser packages was investigated by a finite-element method (FEM). The simulated results showed that Invar–Invar joints with Au coating have maximum stresses two times higher than joints without Au coating. This is due to the different coefficients of the thermal expansion (CTE) between dissimilar materials of Invar and Au, resulting in higher stresses. Maximum stresses were also found to be increased as the Au thickness increased. This effect is attributed to the increase in the thermal gradient in the welded region provided by the increased thermal conduction of the thicker Au coating layer. These results suggest that both the difference in CTE between dissimilar materials and higher thermal conduction of Au coating layer have an important impact on thermally induced stresses for optoelectronic packages having laser-welded Au coated materials.
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References
D. S. Alles, Trends in laser packaging, in Proceedings of the 40th ECTC, 1990, pp. 185–192.
R. Chanchani and P. M. Hall, IEEE Trans. Comp., Hybrids and Manuf. Technol. 13 (1990) 743.
E. Suhir, J. Lightwave Technol. 12 (1994) 1766.
Metals Handbook, Low-expansion Alloys, 8th edn., vol. 8, ASM, (1973) p. 266.
Kovar Alloy Handbook, (Westinghouse Electric Co., PA), 1971.
S. C. Wang, C. M. Wang, C. Wang, H. L. Chang, S. Chi, Y. K. Tu, C. J. Hwang, W. H. Wang and W. H. Cheng, J. Electronic Materials 25 (1996) 1797.
W. H. Cheng, Y. D. Yang, S. C. Wang, M. T. Sheen and J. H. Kuang, IEEE Trans. Comp., Hybrids and Manuf. Technol. 20 (1997) 396.
R. J. Coyle, P.P. Solan, P. L. Sakach and X. L. Yeh, in Proceedings of ASM Int., 2nd Conf. on Trends in Welding Research, (1989) p. 661.
J. C. Chen, W. T. Chen, S. T. Chang, J.S. Horng, H. H. Lin, M. J. Sun, W. H. Wang and W. H. Cheng, in CLEO Technical Digest, (1996) p. 352.
W. H Cheng, W. H. Wang, and J. C. Chen, IEEE Trans Comp., Hybrids and Manuf. Technol. 19 (1996) 764.
S. C. Wang, S. Chi, K. C. Hsieh, Y. D. Yang, and W. H. Cheng, J. Electronic Materials 26 (1997) 1797.
W. H. Cheng, W. H. Wang, Y. D. Yang and J. H. Kung, Opt. Quantum Electron. 29 (1997) 939
M. K. Song, S. G. Kang, N. H. Hwang, H. T. Lee S. S. Park and K. E. Pyun, IEEE Trans. Comp., Hybrids and Manuf. Technol. 19 (1996) 758.
T. Miyazaki, J. Appl. Phys. 48 (1977) 3035.
S. C. Wang, H. L. Chang, C. Wang, C.M. Wang, J.W. Liaw, M. T. Sheen, J. H. Chen, Y. D. Yang, J. H. Kuang, K. C. Hieh and W. H. Cheng, LEOS Conference Proceedings, (1997) p. 283.
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Cheng, W.H., Yang, Y.D., Liang, T.C. et al. Thermal stresses in box-type laser packages. Optical and Quantum Electronics 31, 293–302 (1999). https://doi.org/10.1023/A:1006966021861
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DOI: https://doi.org/10.1023/A:1006966021861