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Delamination behavior of film-substrate systems under cyclic loading

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Journal of Materials Science Letters

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Authors and Affiliations

  1. School of Applied Science, Nanyang Technological University, Singapore, 639798

    Kin Liao & Kai-Tak Wan

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  1. Kin Liao
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  2. Kai-Tak Wan
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Liao, K., Wan, KT. Delamination behavior of film-substrate systems under cyclic loading. Journal of Materials Science Letters 19, 57–59 (2000). https://doi.org/10.1023/A:1006755916044

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