References
P. J. KAY and C. A. MACKAY, Trans. Inst. Met. Fin. 54 (1976) 68.
H. G. TOMPKINS and M. R. PINNEL, J. Appl. Phys. 48(7) (1977) 3144.
C. A. CHANG, ibid. 60(3) (1986) 1220.
W. RIEDeL, “Electroless Nickel Plating” (Finishing Publications Ltd., 1991).
J. W. JANG, P. G. KIM, K. N. TU, D. R. FREAR and P. THOMPSON, J. Appl. Phys. 85(12) (1999) 8456.
K. L. LIN and J. M. JANG, Mat. Chem. Phys. 38 (1994) 33.
H. LI, H. Y. CHEN, S. Z. DONG, J. S. YANG and J. F. DeNG, Appl. Surf. Sci. 125 (1998) 115.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Hung, K.C., Chan, Y.C. Study of Ni3P growth due to solder reaction-assisted crystallization of electroless Ni-P metallization. Journal of Materials Science Letters 19, 1755–1757 (2000). https://doi.org/10.1023/A:1006735103744
Issue Date:
DOI: https://doi.org/10.1023/A:1006735103744