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Characteristics of a Copper Coating Layer on an Alumina Substrate

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Journal of Materials Science Letters

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References

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Authors and Affiliations

  1. Department of Metallurgical Engineering, Inha University, Inchon, 402-751, Korea

    T. W. Lee & C. H. Lee

  2. Department of Materials Science and Engineering, Chung-Ju National University, Chungbuk, 380-702, Korea

    K. Park

Authors
  1. T. W. Lee
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  2. C. H. Lee
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  3. K. Park
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Lee, T.W., Lee, C.H. & Park, K. Characteristics of a Copper Coating Layer on an Alumina Substrate. Journal of Materials Science Letters 18, 571–575 (1999). https://doi.org/10.1023/A:1006695015700

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  • DOI: https://doi.org/10.1023/A:1006695015700

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