References
J. H. Lepagnol, IEEE Trans. (1990) 395.
The Institute for Interconn. and Packag. Elect. Circ., USA, “IPCD-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies” (IPC, 1996).
The Institute for Interconn. and Packag. Elect. Circ., USA, “IPC-9201: Surface Insulation Resistance Handbook” (IPC, 1996).
H. A. Chan, IEEE Trans. Compo., Packag. and Manuf. Technol., C 19 (1996) 300.
J. K. Wassink, in “Soldering in Electronics” (Electrochemical Publications Limited, 1984) p. 141, 166.
F. S. Sandroff and W. H. Burnett, IEEE Trans. (1992) 384.
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Sarkar, G., Chong, Y.F. & Collier, P.A. A Study of the Factors Affecting Surface Insulation Resistance Measurements. Journal of Materials Science Letters 17, 1963–1965 (1998). https://doi.org/10.1023/A:1006635917381
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DOI: https://doi.org/10.1023/A:1006635917381