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Adhesion Property of Copper Nitride Film to Silicon Oxide Substrate

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Journal of Materials Science Letters

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References

  1. C. Patrick Yue, C. Ryu, J. Lau, T. H. Lee and S. S. Wong, in Proceedings of the International Electron Devices Meeting (San Francisco, December,) 1996, edited by IEEE) p. 155.

  2. E. Tarvainen, H. Ronkainen, H. Kattelus, T. Riihisaari and P. Kuivalainen, Phys. Scripta T69 (1997) 295.

    Google Scholar 

  3. W. B Kuhn, A. Elshabini-Riad and F. W. Stephenson, Electronics Lett. 31 (1995) 625.

    Google Scholar 

  4. J. N. Burghartz, D. C. Edelstein, K. A. Jenkins, C. Jahnes, C. Uzoh, E. J. Osullivan, K. K. Chan, M. Soyuer, P. Roper and S. Cordes, in Proceedings of the International Electron Devices Meeting (San Francisco, December, 1996, edited by IEEE) p. 96.

  5. S. P. Murarka, R. J. Gutmann, A. E. Kaloyeros and W. A. Lanford, Thin Solid Films 236 (1993) 257.

    Google Scholar 

  6. E. S. Choi, S. K. Park and H. H. Lee, J. Electrochem. Soc. 143 (1996) 624.

    Google Scholar 

  7. C.-K. Hu, K. Y. Lee, K. L. Lee, C. Cabral, Jr., E. G. Colgan and C. Stanis, ibid. 143 (1996) 1001.

    Google Scholar 

  8. S. Terada, H. Tanakd and K. Kubota, J. Crystal Growth 94 (1989) 567.

    Google Scholar 

  9. M. Asano, K. Umeda and A. Tasaki, Jpn. J. Appl. Phys. 29 (1990) 1985.

    Google Scholar 

  10. T. Maruyama and T. Morishita, Appl. Phys. Lett. 69 (1996) 890.

    Google Scholar 

  11. Idem., J. Appl. Phys. 78 (1995) 4104.

    Google Scholar 

  12. Annual Book of ASTM Standards, Vol. 06.01.

  13. Idem., Vol. 15.09.

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Authors and Affiliations

  1. Department of Inorganic Materials Engineering, Pusan National University, Pusan, 609-735, Korea

    S. O. Chwa & K. H. Kim

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  1. S. O. Chwa
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  2. K. H. Kim
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Chwa, S.O., Kim, K.H. Adhesion Property of Copper Nitride Film to Silicon Oxide Substrate. Journal of Materials Science Letters 17, 1835–1838 (1998). https://doi.org/10.1023/A:1006626124472

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