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Electric field induced interfacial reaction of Au-Ag bimetal film on SiO2 surface

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Abstract

Interface evolution of nanometer scale Au-Ag bimetal film on SiO2 substrate surface during electromigration was investigated by angle resolved X-ray photoelectronspectroscopy (ARXPS). ARXPS spectra showed that a chemical reaction between Au-Ag filmand SiO2 layer occurred at interface, which caused Au, Ag and Si having differentdistribution and chemical states across the film. This result as well as previousobservation by atomic force microscopy (AFM) demonstrate that electromigration of Au-Agbimetal film on SiO2 surface is accompanied with strong interfacial chemicalreaction rather than a simple lateral physical diffusion process.

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Authors and Affiliations

  1. Department of Chemistry, Tsinghua University, Beijing, 100084, People's Republic of China

    F. X. Shi

  2. Department of Chemistry, Tsinghua University, Beijing, 100084, People's Republic of China

    L. L. Cao, W. Q. Yao & X. Y. Ye

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  1. F. X. Shi
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  2. L. L. Cao
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  3. W. Q. Yao
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  4. X. Y. Ye
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Shi, F.X., Cao, L.L., Yao, W.Q. et al. Electric field induced interfacial reaction of Au-Ag bimetal film on SiO2 surface. Journal of Materials Science 35, 3655–3658 (2000). https://doi.org/10.1023/A:1004886118489

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