Abstract
The effects of scanning rate and pre-baking time on the imidization extent, thickness, and stress of polyimide films during the curing process were simultaneously analyzed using FTIR and the strip end deflection detector complemented with interferometer systems. Film thickness and stress increased, but imidization extent decreased with increasing scanning rates. Longer pre-baking times significantly reduced the initial film thickness and stress. Imidization extent, thickness, and stress behavior of polyimide films during the curing process were closely related one another.
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Kook, H.J., Kim, D. In situ measurements and analysis of imidization extent, thickness, and stress during the curing of polyimide films. Journal of Materials Science 35, 2949–2954 (2000). https://doi.org/10.1023/A:1004722609188
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DOI: https://doi.org/10.1023/A:1004722609188