Abstract
Electroformed nickel-tungsten alloy with low internal stress has been obtained in a sulfamate solution by using organic imides namely bis(benzene-sulfonyl)imide and ortho-benzosulfimide as stress-reducing agents. Concurrently, the hardness of the alloy electroforms thus obtained was increased by these imides, especially the ortho-benzosulfimide. The effect of imides on hardness after thermal treatment of the alloy electroforms is also studied.
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Huang, CH. Effect of imides on nickel-tungsten alloy electroforming. Journal of Materials Science 34, 1373–1377 (1999). https://doi.org/10.1023/A:1004570703480
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DOI: https://doi.org/10.1023/A:1004570703480