Abstract
Generally, contact or terminal areas are coated with nickel as a barrier layer; subsequently, gold plating is performed to maintain reliability of electrical interconnection. Treatment using dilute solutions of palladium ions have been applied to initiate electroless nickel plating on copper substrates because copper has no catalytic action for the oxidation of hypophosphite. However, trace amounts of palladium ions may remain on the unwanted areas and extraneous nickel deposits are often observed. We confirmed that nickel films without extraneous deposits can be formed using the activation solutions containing dimethyl amine borane (DMAB). Bondability on the electrolessly deposited gold was greatly influenced by the phosphorus contents of the deposited nickel films as the underlayer. Bonding strength after electroless gold plating was increased with increasing phosphorus contents in the nickel films. Stabilizers in the electroless gold plating also influenced the bonding strength. Baths containing cupferron or potassium nickel cyanide as a stabilizer showed superior bondability. Gold deposits having strong orientation with Au(220) and Au(311) indicated high bond strength.
Similar content being viewed by others
References
Y. Okinaka, Plat. Surf. Finish. 57 (1970) 914.
M. F. EL-Shazly and K. D. Baker, US patent 4 337 091 (1982).
C. D. Lacovangelo and K. P. Zarnoch, J. Electrochem. Soc. 138 (1991) 938.
C. D. Lacovangelo, J. Electrochem. Soc. 138 (1991) 976.
A. R. Burke and W. V. Hough, US patent 4 080 381 (1978).
A. R. Burke, W. V. Hough and G. T. Hefferan, US patent 4 142 909 (1979).
F. Richter, R. Gesemann, L. Gierth and E. Hoyer, German (East) patent 150 762 (1981).
R. Gesemann, F. Richter, L. Gierth, E. Hoyer and J. Hartung, German (East) patent 160 284 (1983).
J. L. Little, Gold Patent Digest 1(4), (1983) 15.
M. Kato, K. Niikura, S. Hoshino and I. Ohno, J. Surf. Finish. Soc. Jnp. 42 (1991) 729.
Y. Sato, T. Osawa, K. Kaieda and K. Kobayakawa, Plat. Surf. Finish. 81 (1994) 74.
H. Honma and Y. Kagaya, J. Electrochem. Soc. 140 (1994) L135.
H. Honma, A. Hasegawa, S. Hotta and K. Hagiwara, Plat. Surf. Finish. 82 (1995) 89.
H. Honma and K. Hagiwara, J. Electrochem. Soc. 142 (1995) 81.
I. Ohno, O. Wakabayashi and S. Haruyama, J. Electrochem. Soc. 132 (1985) 2323.
J. A. Gardiner, J. W. Collat, J. Am. Chem. Soc. 86 (1964) 3165.
Y. Okinaka and C. Wolowodiuk, Plat. Surf. Finish. 58 (1971) 1080.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Watanabe, H., Abe, S. & Honma, H. Gold wire bondability of electroless gold plating using disulfiteaurate complex. Journal of Applied Electrochemistry 28, 525–529 (1998). https://doi.org/10.1023/A:1003273329474
Issue Date:
DOI: https://doi.org/10.1023/A:1003273329474