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Solution equilibrium characteristics of electroless copper deposition on thermally-activated palladium-catalysed polyimide substrates

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Abstract

Solution equilibrium characteristics of two electroless copper baths containing EDTA and tartrate as the complexing agents were studied as functions of pH. Equilibrium diagrams were constructed for both Cu-tartrate and Cu-EDTA systems. It was determined that copper is chiefly complexed as Cu2L2 in acidic conditions and as Cu(OH)2L2−4 in alkaline conditions in the tartrate bath, and as CuA−2 in the EDTA bath, where L and A are the complexing tartrate and EDTA ligands, respectively. Electroless copper deposition rates were studied from a tartrate bath on thermally activated palladium-catalysed polyimide substrates as functions of copper and formaldehyde concentrations, and pH.

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References

  1. J. Hajdu, Plat. Surf. Finish. 83 (1996) 29.

    Google Scholar 

  2. P. C. Hidber, P. F. Nealey, W. Helbig and G. M. Whitsides, Langmuir 12 (1996) 5209.

    Google Scholar 

  3. Y. Shacham-Diamand, V. Dubin and M. Angyal, Thin Solid Films 262 (1995) 93.

    Google Scholar 

  4. H. Yoshiki, K. Hashimoto and A. Fujishima, Metal Finish. 94 (1996) 28.

    Google Scholar 

  5. E. F. Tokas, R. M. Shaltout and K. S. Chen, US patent 5 348 574 (1994).

  6. L. N. Schoenberg, J. Electrochem. Soc. 118 (1971) 1571.

    Google Scholar 

  7. J. F. Walker, ‘Formaldehyde’, 3 edn, Reinhold, New York (1964).

    Google Scholar 

  8. J. A. Dean, (Ed.), ‘Lange’s Handbook of Chemistry’, McGraw-Hill, New York (1992).

    Google Scholar 

  9. D. D. Perrin (Ed.), ‘Stability Constants of Metal-Ion Complexes, Part B: Organic Ligands’, IUPAC Chemical Data Series-No. 22, Pergamon Press, New York (1979).

    Google Scholar 

  10. J. Duffy, L. Pearson and M. Paunovic, J. Electrochem. Soc. 130 (1983) 876.

    Google Scholar 

  11. M. Paunovic, J. Electrochem. Soc. 125 (1978) 173.

    Google Scholar 

  12. J. K. Hovey and P. R. Tremaine, J. Phys. Chem. 89 (1985) 5541.

    Google Scholar 

  13. S. M. El-Raghy and A. A. Abo-Salama, J. Electrochem. Soc. 126 (1979) 171.

    Google Scholar 

  14. F. L. Shippey and F. M. Donahue, Plating. 60 (1973) 43.

    Google Scholar 

  15. F. M. Donahue, Oberflache-Surface. 13 (1972) 301.

    Google Scholar 

  16. R. C. Weast (Ed.), ‘CRC Handbook of Chemistry and Physics’, 59th edn, CRC Press, Boca Raton, FL (1978/ 1979).

    Google Scholar 

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Authors and Affiliations

  1. Department of Chemical Engineering, University of South Carolina, Columbia, SC-, 29208, USA

    M. Ramasubramanian, B. N. Popov & R. E. White

  2. Engineering Sciences Center, Sandia National Laboratories, Albuquerque, NM, 87185-0826, USA

    K. S. Chen

Authors
  1. M. Ramasubramanian
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  2. B. N. Popov
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  3. R. E. White
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  4. K. S. Chen
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Ramasubramanian, M., Popov, B.N., White, R.E. et al. Solution equilibrium characteristics of electroless copper deposition on thermally-activated palladium-catalysed polyimide substrates. Journal of Applied Electrochemistry 28, 737–743 (1998). https://doi.org/10.1023/A:1003202413045

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  • DOI: https://doi.org/10.1023/A:1003202413045

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