Abstract
The adsorption behaviour of polyethylene glycol (PEG) in the presence of chloride ion in an acid copper electrolyte was investigated by several electrochemical methods including chronopotentiometry, linear sweep voltammetry, cyclic voltammetry and electrochemical impedance. Surface coverages calculated from the chronopotentiometry measurement were fitted into the Toth isotherm with good agreement. The standard free energy of PEG adsorption, ΔG ∘ ads, evaluated to be −51.67 kJ mol−1 indicates strong interaction between PEG and the copper surface. Current–potential hysteresis was found in bath with low PEG concentration as the result of low PEG adsorption rate. Void-free anisotropic deposition for IC copper interconnect can thus be achieved with the addition of PEG only by properly adjusting its concentration based on its adsorption behaviour.
Similar content being viewed by others
References
P. Taephaisitphongse, Y. Cao and A.C. West, J. Electrochem. Soc. 148 (2001) C492.
T.P. Moffat, J.E. Bonevich, W.H. Huber, A. Stanishevsky, D.R. Kelly, G.R. Stafford and D. Josell, J. Electrochem. Soc. 147 (2000) 4524.
J.J. Kelly and A.C. West, J. Electrochem. Soc. 145 (1998) 3472.
J.J. Kelly and A.C. West, J. Electrochem. Soc. 145 (1998) 3477.
D. Stoychev, Trans IMF 76(2) (1998) 73.
J.D. Reid and A.P. David, Plat. Surf. Finish. 74 (1987) 66.
T.P. Moffat, D. Wheeler, W.H. Huber and D. Josell, Electrochem. & Solid-State Lett. 4(4) (2001) C26.
Y. Cao, P. Taephaisitphongse and A.C. West, J. Electrochem. Soc. 148 (2001) C466.
K.R. Hebert, J. Electrochem. Soc. 148 (2001) C726.
A.C. West, S. Mayer and J. Reid, Electrochem. & Solid-State Lett. 4 (2001) C50.
W.C. Gau and T.C. Chang, J. Vac. Sci. Technol. A 18 (2000) 656.
M. Hayase, M. Taketani, K. Aizawa, T. Hatsuzawa and K. Hayabusa, Electrochem. & Solid-State Lett. 5(10) (2002) C98.
T.C. Franklin, Plat. Surf. Finish. 81 1994) 62.
A.J. Bard and L.R. Faulkner, ‘Electrochemical Methods’ (J. Wiley & Sons, New York, 2nd edn, 2001), and references therein.
Z. Nagy, J.P. Blaudeau, N.C. Hung, L.A. Curtiss and D.J. Zurawski, J. Electrochem. Soc. 142 (1995) L87.
D. Stoychev and C. Tsvetanov, J. Appl. Electrochem. 26 (1996) 741.
K.G. Jordan and C.W. Tobias, J. Electrochem. Soc. 138 (1991) 1251.
C. Madore and D. Landolt, J. Electrochem. Soc. 143 (1996) 3936.
R. Cabán and T.W. Chapman, J. Electrochem. Soc. 124 (1977) 1371.
R.I. Masel, ‘Principles of Adsorption and Reaction on Solid Surfaces’ (J. Wiley & Sons, New York, 1996), and references therein.
E. Gileadi, 'Electrode Kinetics', (VCH, Weinheim, 1993), and references therein.
P. Kern and D. Landolt, J. Electrochem. Soc. 148 (2001) B228.
J. Toth, Acta Chim. Acad. Sci. Hung. 69 (1971) 311.
T. Mimani and S.M. Mayanna, J. Electrochem. Soc. 140 (1993) 984.
B.H. Wu, C.C. Wan and Y.Y. Wang, J. Electrochem. Soc. 150 (2003) C7.
A.C. West, C.C. Cheng and B.C. Baker, J. Electrochem. Soc. 145 (1998) 3070.
E. Lust, A. Janes, K. Lust, V. Sammelselg and P. Miidla, Electrochim. Acta 42 (1997) 2861.
G. Jarzabek and Z. Borkowska, Electrochim. Acta 42 (1997) 2915.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Wu, BH., Wan, CC. & Wang, YY. Void-free anisotropic deposition for IC interconnect with polyethylene glycol as the single additive based on uneven adsorption distribution. Journal of Applied Electrochemistry 33, 823–830 (2003). https://doi.org/10.1023/A:1025550725883
Issue Date:
DOI: https://doi.org/10.1023/A:1025550725883