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Journal of Applied Electrochemistry

, Volume 31, Issue 9, pp 1061–1066 | Cite as

Kinetics of electroless silver deposition using cobalt(II)-ammonia complex compounds as reducing agents

  • E. Norkus
  • A. Vaškelis
  • A. Jagminienė
  • L. Tamašauskaitė-Tamašiūnaitė
Article

Abstract

The kinetics of electroless silver deposition from solutions containing Co(II)-ammonia complex compounds as reducing agents was studied at 20 and 50 °C. The process rate depends on the solution pH and the concentration of Ag(I), Co(II) and ammonia species. Under optimum operating conditions selected a silver deposition rate up to 1.2 μm h−1 can be obtained at 20 °C with high solution stability. At elevated temperature (50 °C) the rate increases and reaches ∼3 μm h−1. The silver coatings obtained are of high quality, compact and bright.

ammonia cobalt(II) electroless silver deposition silver(I) 

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Copyright information

© Kluwer Academic Publishers 2001

Authors and Affiliations

  • E. Norkus
    • 1
  • A. Vaškelis
    • 1
  • A. Jagminienė
    • 1
  • L. Tamašauskaitė-Tamašiūnaitė
    • 1
  1. 1.Department of Chemical Kinetics and CatalysisInstitute of ChemistryVilniusLithuania

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