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Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features

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Li, W., Ye, J. & Li, S. Electrochemical deposition of Copper on patterned Cu/Ta(N)/SiO2 surfaces for super filling of sub-micron features. Journal of Applied Electrochemistry 31, 1395–1397 (2001). https://doi.org/10.1023/A:1013872107905

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  • DOI: https://doi.org/10.1023/A:1013872107905

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