Journal of Materials Science

, Volume 37, Issue 22, pp 4793–4799 | Cite as

The characterization of thermal and elastic constants for an epoxy photoresist SU8 coating

  • R. Feng
  • R. J. FarrisEmail author


All of the thermal and elastic constants of the high-aspect ratio, negative, UV resist, SU8 coating were carried out, and the compliance matrix of the coating was obtained. DSC, TGA, TMA, and DMTA techniques were utilized to study the thermal properties of the material. The in-plane thermal expansion coefficient (TEC) (α1) was determined by TMA, and the glass transition behavior was studied by DMTA. The TGA study provided information about the thermal stability of the material, and DSC was applied to study the thermal calorimetric properties of the material. The in-plane Young's modulus (E1) was measured by tensile tests. The residual stresses of a 1D stretched ribbon sample and a 2D stretched membrane sample were measured by vibrational holography tests, and the in-plane Poisson's ratio (ν1) was also determined by holography. The out-of-plane Poisson's ratio (ν2) was obtained by high pressure gas dilatometry measurements. The bulk compressibility (κ) and the volumetric TEC (α v ) of the material were measured by a pressure-volume-temperature (PVT) apparatus. Finally, the out-of-plane properties, including the out-of-plane TEC (α2) and the out-of-plane Young's modulus (E2), were calculated from the measured in-plane properties and the volumetric properties. Therefore, the compliance matrix of the studied SU8 coating could be obtained.


Residual Stress Thermal Expansion Coefficient Dilatometry Compliance Matrix Bulk Compressibility 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.


Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.


  1. 1.
    J. M. SHAW, J. D. GELOME, N. C. LABIANCA, W. E. CONLEY and S. J. HOLMES, IBM J. Res. Dev. 41 (1997) 81.Google Scholar
  2. 2.
    B. EYRE, J. BLOSIU and D. WIBERG, in 11th IEEE Micro. Elec. Mech. Sys., Chicago, USA, 1995, 218.Google Scholar
  3. 3.
    A. BERTSCH, H. LORENZ and P. RENAND, in IEEE Micro. Electro. Mech. Sys., Chicago, USA, 1998, 18.Google Scholar
  4. 4.
    R. FENG and R. J. FARRIS, “Influence of Processing Conditions on the Thermal and Mechanical Properties of SU8 Negative Photoresist Coatings, ” J. Micromech. Microeng. (2002), submitted.Google Scholar
  5. 5.
    M. DESPONT, H. LORENZ, N. FAHRNI, J. BRUGGER, P. RENAUD and P. VETTIGER, in 10th, IEEE Micro. Electro. Mech. Sys., Nagoya, Japan, 1997, 518.Google Scholar
  6. 6.
    H. LORENZ, M. LAUDON and P. RENAUD, Microelec. Eng. 41/42 (1998) 371.Google Scholar
  7. 7.
    H. LORENZ, M. DESPONT, N. FAHRNI, N. LaBIANCA, P. VETTIGER and P. RENAUD, J. Macromech, Microeng. 7 (1997) 121.Google Scholar
  8. 8.
    N. LaBIANCA, J. GELORME and K. LEE, Elec. Soc. Proc. V95-18 (1993) 386.Google Scholar
  9. 9.
    W. M. LAI, D. RUBIN and E. KREMPL, “Introduction to Continuum Mechanics” (Butterworth, Heinemann, 1996).Google Scholar
  10. 10.
    S. CHO, G. KIM, T. McCARTHY and R. FARRIS, Polym. Eng. Sci. 41 (2001) 301.Google Scholar
  11. 11.
    R. FENG and R. J. FARRIS, J. Appl. Polym. Sci., in print, 2002.Google Scholar
  12. 12.
    M. J. CHEN, PhD thesis, University of Massachusetts at Amherst, 1998.Google Scholar
  13. 13.
    Q. K. TONG, PhD thesis, University of Massachusetts at Amherst, 1993.Google Scholar
  14. 14.
    M. MADEN, A. JAGOTA, S. MAZUR and R. FARRIS, J. Amer. Cerm. Soc. 77 (1994) 625.Google Scholar
  15. 15.
    M. MADEN, PhD thesis, University of Massachusetts, 1992.Google Scholar
  16. 16.
    R. J. FARRIS, J. Appl. Polym. Sci. 8 (1964) 25.Google Scholar
  17. 17.
    G. RAUMANN, Proc. Phys. Soc. 79 (1962) 1221.Google Scholar
  18. 18.
    S. LEKHNITSKII, “Theory of Elasticity of an Anisotropic Elastic Body, Eng. Trans.” (Moscow, MIR publishers, 1981).Google Scholar

Copyright information

© Kluwer Academic Publishers 2002

Authors and Affiliations

  1. 1.Polymer Science and Engineering DepartmentUniversity of Massachusetts AmherstAmherstUSA

Personalised recommendations