Journal of Materials Science

, Volume 32, Issue 21, pp 5571–5575 | Cite as

Counteracting particulate segregation during transient liquid-phase bonding of MMC-MMC and Al2O3-MMC joints

  • Y ZHAI
  • T. H NORTH


The microstructure and mechanical properties of MMC-MMC and Al2O3-MMC joints (MMC is metal matrix composite) produced at a bonding temperature of 853 K using copper foils ranging in thickness from 10 to 30 μm were examined. The particle segregation tendency during transient liquid-phase (TLP) bonding of aluminium-based MMC material markedly increases when the aluminium-based composite material contains large number of small radius (less than 10 μm) reinforcing particles. Also, the particle segregation tendency is much greater in dissimilar Al2O3-MMC joining since the rate of solid-liquid interface movement is much slower and the time required for completing the isothermal solidification during TLP bonding is much longer. The particle segregation tendency during MMC-MMC and Al2O3-MMC bonding can be counteracted using a combination of a short (1 min) holding time at the bonding temperature (853 K) and subsequent post-weld heat treatment at 773 K for 4 h. This TLP-bonding-heat-treatment cycle removes the retained eutectic phase present at the joint centreline.


Shear Strength Copper Foil Bonding Temperature Eutectic Phase Joint Shear Strength 


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Copyright information

© Chapman and Hall 1997

Authors and Affiliations

  • Y ZHAI
    • 1
  • T. H NORTH
    • 1
  1. 1.Department of Metallurgy and Materials ScienceUniversity of TorontoTorontoCanada

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