Journal of Applied Electrochemistry

, Volume 32, Issue 2, pp 135–143 | Cite as

Unsteady diffusion effects on electrodeposition into a submicron trench

Article

Abstract

Electrodeposition of a metal into rectangular cross-section trenches by the application of a current or potential step is investigated via numerical simulations. The feasibility of decoupling of the phenomena occurring on scales of the trench filling time and the species diffusion time is examined. Short time scale events under potentiostatic plating conditions are compared with those events that occur under galvanostatic conditions. Two numerical schemes, the finite volume method (FVM) and the boundary element method (BEM), are used in solving the unsteady diffusion problems. Furthermore, unsteady diffusion with nonlinear reaction rate kinetics on the cathode is considered.

copper electrodeposition simulation galvanostatic potentiostatic submicron features unsteady diffusion 

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Copyright information

© Kluwer Academic Publishers 2002

Authors and Affiliations

  1. 1.Department of Chemical EngineeringColumbia UniversityNew York

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