Molecular Interlayers and the Mechanism of Abrasive Wear of Ultrathin Metal Films
Striking differences have been observed in the deformation modes associated with nanoscratch events on ultrathin Cu layers deposited on SiOx with and without a dendrimer interlayer. In the absence of the dendrimer monolayer significant lateral deformation and distinct ridge formation along the wear track indicative of plowing and wedge formation are observed. By contrast, dendrimer monolayer-mediated films exhibit restricted lateral deformation yielding ridgeless scratches apparently formed in a nearly pure cutting mode.
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