Journal of Computer-Aided Materials Design

, Volume 4, Issue 3, pp 175–182 | Cite as

Models for low-dimensional thermoelectricity

  • T. Koga
  • X. Sun
  • S.B. Cronin
  • M.S. Dresselhaus
  • K.L. Wang
  • G. Chen
Article

Abstract

Enhanced thermoelectric performance, expressed in terms of the thermoelectric figure of merit (ZT), has been predicted theoretically for low-dimensional electronic systems under appropriate experimental conditions. Enhanced ZT has been observed experimentally within 2D quantum wells of PbTe, and good agreement between theory and experiment has been obtained. The advantages of low-dimensional systems for thermoelectric applications are described, and prospects for further enhancement of ZT are discussed.

Semiconductor Multiple quantum wells Superlattices Thermoelectricity Figure of merit ZT Bi2Te3 PbTe GaAs/AlAs 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

REFERENCES

  1. 1.
    Goldsmid, H.J., Electronic Refrigeration, Pion, London, 1986.Google Scholar
  2. 2.
    Hicks, L.D. and Dresselhaus, M.S., Phys. Rev. B, 47 (1993) 12727.Google Scholar
  3. 3.
    Hicks, L.D. and Dresselhaus, M.S., In Tu, C.W., Houghton, D.C. and Tung, R.T. (Eds.) Semiconductor Heterostructures for Photonic and Electronic Applications: MRS Symposia Proceedings, Boston, Vol. 281, Materials Research Society Press, Pittsburgh, PA, U.S.A., 1993, p. 821.Google Scholar
  4. 4.
    Yuan, S., Krenn, H., Springholz, G. and Bauer, G., Phys. Rev. B, 47 (1993) 7213.Google Scholar
  5. 5.
    Hicks, L.D., Harman, T.C., Sun, X. and Dresselhaus, M.S., Phys. Rev. B, 53 (1996) R10493.Google Scholar
  6. 6.
    Harman, T.C., Spears, D.L. and Manfra, M.J., J. Electron. Mater., 25 (1996) 1121.Google Scholar
  7. 7.
    Dornhaus, R., Nimtz, G. and Schlicht, B., Narrow-Gap Semiconductors, Springer Tracts in Modern Physics, Vol. 98, Springer, Berlin, Germany, 1985.Google Scholar
  8. 8.
    Hicks, L.D. and Dresselhaus, M.S., Phys. Rev. B, 47 (1993) 16631.Google Scholar
  9. 9.
    Hicks, L.D., Harman, T.C. and Dresselhaus, M.S., Appl. Phys. Lett., 63 (1993) 3230.Google Scholar
  10. 10.
    Chen, G., J. Heat Transf. Trans. ASME, 119 (1997) 220.Google Scholar

Copyright information

© Kluwer Academic Publishers 1998

Authors and Affiliations

  • T. Koga
    • 1
  • X. Sun
    • 2
  • S.B. Cronin
    • 2
  • M.S. Dresselhaus
    • 2
    • 3
  • K.L. Wang
    • 4
  • G. Chen
    • 4
  1. 1.Division of Engineering and Applied SciencesHarvard UniversityCambridgeU.S.A
  2. 2.Department of PhysicsMassachusetts Institute of TechnologyCambridgeU.S.A
  3. 3.Department of Electrical Engineering and Computer ScienceMassachusetts Institute of TechnologyCambridgeU.S.A
  4. 4.School of EngineeringUniversity of CaliforniaLos AngelesU.S.A

Personalised recommendations