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Journal of Materials Science Letters

, Volume 17, Issue 23, pp 1963–1965 | Cite as

A Study of the Factors Affecting Surface Insulation Resistance Measurements

  • G. Sarkar
  • Y. F. Chong
  • P. A. Collier
Article

Keywords

Polymer Resistance Measurement Surface Insulation Insulation Resistance Measurement 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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References

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    J. H. Lepagnol, IEEE Trans. (1990) 395.Google Scholar
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    The Institute for Interconn. and Packag. Elect. Circ., USA, “IPCD-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies” (IPC, 1996).Google Scholar
  3. 3.
    The Institute for Interconn. and Packag. Elect. Circ., USA, “IPC-9201: Surface Insulation Resistance Handbook” (IPC, 1996).Google Scholar
  4. 4.
    H. A. Chan, IEEE Trans. Compo., Packag. and Manuf. Technol., C 19 (1996) 300.Google Scholar
  5. 5.
    J. K. Wassink, in “Soldering in Electronics” (Electrochemical Publications Limited, 1984) p. 141, 166.Google Scholar
  6. 6.
    F. S. Sandroff and W. H. Burnett, IEEE Trans. (1992) 384.Google Scholar

Copyright information

© Kluwer Academic Publishers 1998

Authors and Affiliations

  • G. Sarkar
    • 1
  • Y. F. Chong
    • 1
  • P. A. Collier
    • 2
  1. 1.School of Applied ScienceNanyang Technological UniversitySingapore
  2. 2.Institute of MicroelectronicsSingapore

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