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Journal of Materials Science

, Volume 35, Issue 12, pp 2949–2954 | Cite as

In situ measurements and analysis of imidization extent, thickness, and stress during the curing of polyimide films

  • H. J. Kook
  • D. Kim
Article

Abstract

The effects of scanning rate and pre-baking time on the imidization extent, thickness, and stress of polyimide films during the curing process were simultaneously analyzed using FTIR and the strip end deflection detector complemented with interferometer systems. Film thickness and stress increased, but imidization extent decreased with increasing scanning rates. Longer pre-baking times significantly reduced the initial film thickness and stress. Imidization extent, thickness, and stress behavior of polyimide films during the curing process were closely related one another.

Keywords

Polymer Film Thickness Polyimide Scanning Rate Cure Process 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Kluwer Academic Publishers 2000

Authors and Affiliations

  • H. J. Kook
    • 1
  • D. Kim
    • 2
  1. 1.Industrial Materials UnitLG Chemical Ltd.SeoulSouth Korea
  2. 2.Department of Chemical Engineering, Polymer Research CenterSungkyunkwan UniversitySuwonKorea

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