Coupled Thermo-Mechanical Analysis of Functionally Gradient Weak/Micro-Discontinuous Interface with Graded Finite Element Method
Coupled thermo-mechanical analysis of two bonded functionally graded materials subjected to thermal loads is conducted in this study with the graded finite element method. The thermal-mechanical properties of the bi-material interfaces are classified based on discontinuity degrees of their material properties and their derivatives at the interfaces. Numerical results indicate that discontinuity exerts remarkable effect on the temperature profile and stress value at the interface of two bonded functionally-graded materials. Under the thermal flux loading conditions, the stronger the interface discontinuity is, the smaller the heat flux is.
Key wordsfunctionally graded material thermo-mechanical analysis weak/micro discontinuous graded finite element method
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- Reddy, J.N. and Chin, C.D., Thermomechanical analysis of functionally graded cylinders and plates. International Journal of Solids and Structures, 1998, 21: 593–626.Google Scholar
- Hetnarski, R.B. and Eslami, M.R., Thermal Stresses-Advanced Theory and Applications. Springer, 2009.Google Scholar