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Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution

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Abstract

Various environment legislations lead to the ban of Pb in solder alloy making. Solder alloy is an integral part of electronic packaging industry. As a result of this researchers were searching for new combinations without lead which can replace Sn–Pb solder alloy. The new lead free solder joint should possess good mechanical properties, good wetting properties and good corrosion resistance properties. Many lead free solder alloys were discovered. Sn–0.5Cu–3Bi is a good candidate for replacing the Sn–Pb alloy with good properties. The addition of Ag into the alloy enhanced the properties, especially 1% by wt. Ag. In this paper, investigations on the corrosion behavior of Sn–0.5Cu–3Bi–xAg (x = 0, 0.5, 1% by wt.) in 3.5% NaCl is carried out using weight loss method. Microstructure and EDAX analysis were also conducted in the analysis. It is found that the corrosion rate is minimum with 1% by wt. addition of Ag. Corrosion rate is less when compared with the SAC (Sn–Ag–Cu). Sn–0.5Cu–3Bi–1Ag can be considered as a potential lead free solder joint with good corrosion resistance.

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References

  1. M. Mel, Schwartz, Soldering: Understanding the Basics, 1st edn. (ASM International, West Conshohocken, 2014)

    Google Scholar 

  2. NCMS Lead-Free Solder Project Final Report, NCMS, National Center for Manufacturing Sciences, 3025 Boardwalk, Ann Arbor, Michigan 48108-3266, Report 0401RE96, August 1997

  3. M. Mccormack, S. Jin, JEM 23, 715 (1994). https://doi.org/10.1007/BF02651364

    Article  CAS  Google Scholar 

  4. J. Glazer, JEM 23, 693 (1994). https://doi.org/10.1007/BF02651361

    Article  CAS  Google Scholar 

  5. Management Methods for Restriction of the Use of Hazardous Substances in Electrical and Electronic Products, http://www.chinarohs.com. Accessed 1 July 2019

  6. J-Moss (Japanese RoHS), http://home.jeita.or.jp/eps/jmoss_en.htm. Accessed 1 July 2019

  7. Act for Resource Recycling of Electrical and Electronic Equipment and Vehicles, http://www.rsjtechnical.com/images/Documents/Korea_RoHS_ELV_April_2007_EcoFrontier.pdf. Accessed 1 July 2019

  8. Turkey Announces RoHS Legislation, http://www.intertek.com/news/2008/10-28-turkey-announces-rohs-legislation/. Accessed 1 July 2019

  9. Restrictions on the Use of Certain Hazardous Substances (RoHS) in Electronic Devices, https://www.dtsc.ca.gov/HazardousWaste/RoHS.cfm. Accessed 1 July 2019

  10. K.N. Tu, A.M. Gusak, M. Li, Physics and materials challenges for lead-free solders. J. Appl. Phys. 93, 1335–1353 (2003)

    Article  CAS  Google Scholar 

  11. H.T. Ma, J.C. Suhling, A review of mechanical properties of lead-free solder for electronic packaging. J. Mater. Sci. 44, 1141–1158 (2009)

    Article  CAS  Google Scholar 

  12. M. Wang, J. Wang, H. Feng, W. Ke, J. Mater. Sci. Mater. Electron. 23, 148–155 (2012)

    Article  CAS  Google Scholar 

  13. S. Jayesh, J. Elias, Met. Mater. Int. (2019). https://doi.org/10.1007/s12540-019-00305-3

    Article  Google Scholar 

  14. S. Jayesh, J. Elias, Experimental investigations on the effect of addition of Ag into ternary lead free solder alloy Sn–1Cu–1Ni. Lett Mater 9(2), 239–242 (2019)

    Article  Google Scholar 

  15. S. Jayesh, J. Elias, Int J Simul Multidiscip Des Optim 10, A11 (2019). https://doi.org/10.1051/smdo/2019013

    Article  Google Scholar 

  16. L.C. Tsao, Corrosion Resistance (In Tech, Shanghai, 2012), pp. 107–132

    Google Scholar 

  17. D.Q. Yu, W. Jillek, E. Schmitt, J. Mater. Sci. Mater. Electron. 17, 219–227 (2006)

    Article  CAS  Google Scholar 

  18. S. Meschter, P. Snugovsky, Z. Bagheri, E. Kosiba, M. Romansky, J. Kennedy, L. Snugovsky, JOM J. Min. Met. Mat. S 66, 2320–2333 (2014)

    Article  CAS  Google Scholar 

  19. W. Lawson, The effects of design and environmental factors on the reliability of electronic products. Ph.D. Thesis, Salford University (2007)

  20. Dezhi Li, Paul P. Conway, Changqing Liu, Corros. Sci. 50, 995–1004 (2008)

    Article  CAS  Google Scholar 

  21. C.W. See et al., Corrosion behavior of corroded Sn–3.0Ag–0.5Cu solder alloy. Procedia Chem 19, 847–854 (2016). https://doi.org/10.1016/j.proche.2016.03.112

    Article  CAS  Google Scholar 

  22. R. Baboian, Corrosion Tests and Standards: Application and Interpretation, 2nd edn. (ASTM International, West Conshohocken, 2005). https://doi.org/10.1520/MNL20-2ND-EB

    Book  Google Scholar 

Download references

Acknowledgements

This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

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  1. Department of Mechanical Engineering, School of Engineering, Cochin University of Science and Technology, Kochi, Kerala, 682022, India

    S. Jayesh & Jacob Elias

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  1. S. Jayesh
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  2. Jacob Elias
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Jayesh, S., Elias, J. Investigations on the Corrosion Properties of Sn–0.5Cu–Bi–xAg Lead Free Solder Alloys in 3.5% NaCl Solution. Trans. Electr. Electron. Mater. 22, 150–159 (2021). https://doi.org/10.1007/s42341-020-00219-7

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  • DOI: https://doi.org/10.1007/s42341-020-00219-7

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