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Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films

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Abstract

Hybrid filler loaded multi-layer polymer composites are becoming one of the suitable alternative material for electromagnetic interference shielding (EMIS) applications. Mainly these composites are manufactured by conductive/magnetic fabrics, foams, foils or films or a combination of all, layered in an orderly architecture to obtain effective EMIS. In this work, dendrite structured copper particulate dispersed in cellulose acetate polymer (CA). We have developed approximately 100-micron thickness of cellulose acetate/copper filler (CA/Cu) films (7–55 wt%) and a neat CA film. The electrical conductivity, tensile strength, percentage of elongation, burst strength and folding endurance of CA/Cu films were measured and compared. The percolation threshold for conductivity was found at 28 wt% and the drastic increase in conductivity at 28–37 wt%. The mechanical strength of CA/Cu composite films was investigated and reported.

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Authors and Affiliations

  1. Department of Mechanical and Manufacturing Engineering, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal, 576104, India

    B. Shivamurthy, Rohan Purushothama & G. K. V. D. Datta Sai

  2. Department of Chemistry, Manipal Institute of Technology, Manipal Academy of Higher Education, Manipal, 576104, India

    B. H. S. Thimmappa

Authors
  1. B. Shivamurthy
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  2. B. H. S. Thimmappa
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  3. Rohan Purushothama
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  4. G. K. V. D. Datta Sai
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Correspondence to B. H. S. Thimmappa.

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Shivamurthy, B., Thimmappa, B.H.S., Purushothama, R. et al. Electrical Conductivity and Mechanical Properties of Dendritic Copper Particulate Polymer Films. Trans. Electr. Electron. Mater. 20, 99–106 (2019). https://doi.org/10.1007/s42341-018-00085-4

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  • DOI: https://doi.org/10.1007/s42341-018-00085-4

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