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In-Process Measurement of Thickness of Cured Resin in Evanescent-Wave-Based Nano-stereolithography Using Critical Angle Reflection

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Abstract

Stereolithography is one of the most powerful ways to fabricate complex three-dimensional polymeric-based structures layer-by-layer using optical power. Evanescent-wave-based nano-stereolithography using ultra-thin field distribution of evanescent wave to solidify photosensitive resin can provide a sub-micrometer vertical resolution of each layer. To meet strong demands for in-process thickness measurement of cured resin in evanescent-wave-based nano-stereolithography, a measurement method that utilizes variations of resin’s refractive index after polymerization and a high sensitivity of total internal reflection at the critical angle has been proposed. By launching the a measurement light from a substrate to resin at the critical angle and detecting reflections from the resin, slight change in refractive index and thickness of cured resin that have great influences on reflectivity can be in-process measured. This method has been firstly examined by simulation using the rigorous coupled wave analysis method. Here, we show that an increase in cured resin’s thickness induces a decrease in the reflectivity. In experiments, the largest reflectivity contrast between cured and uncured resins has been proved at the critical angle. In addition, the relationship between reflectivity drop and thickness has been calibrated and a linear relationship within a certain thickness range has been experimentally confirmed. Furthermore, the difference of curing process between continuous and discontinuous exposure has been investigated by using the proposed measurement method. At last, image subtraction and a median filter have been applied in imaging processing to remove influences of uneven illumination and background noises.

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Authors and Affiliations

  1. Department of Advanced Interdisciplinary Studies, The University of Tokyo, Komaba 4-6-1, Meguro, Tokyo, 153-8904, Japan

    Deqing Kong

  2. Research Center for Advanced Science and Technology, The University of Tokyo, Komaba 4-6-1, Meguro, Tokyo, 153-8904, Japan

    Masaki Michihata & Satoru Takahashi

  3. Department of Precision Engineering, The University of Tokyo, Hongo 7-3-1, Bunkyo, Tokyo, 113-8656, Japan

    Kiyoshi Takamasu

Authors
  1. Deqing Kong
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  2. Masaki Michihata
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  3. Kiyoshi Takamasu
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  4. Satoru Takahashi
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Correspondence to Masaki Michihata.

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Kong, D., Michihata, M., Takamasu, K. et al. In-Process Measurement of Thickness of Cured Resin in Evanescent-Wave-Based Nano-stereolithography Using Critical Angle Reflection. Nanomanuf Metrol 1, 112–124 (2018). https://doi.org/10.1007/s41871-018-0013-z

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  • DOI: https://doi.org/10.1007/s41871-018-0013-z

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