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Experimental Investigations of a Minichannel Heat Sink for Electronic Applications

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Iranian Journal of Science and Technology, Transactions of Mechanical Engineering Aims and scope Submit manuscript

Abstract

In the current study, a new configuration of minichannels is proposed to improve the thermal performance of conventional plate-fin aluminum heat sink used for the thermal management of the electronic components. The case under consideration to implement the current idea is an aluminum heat sink equipped with rectangular square minichannels. Hence, an enhanced model is investigated, and the obtained results are evaluated as compared with the conventional plate-fin aluminum heat sink. A minichannel heat sink (MC-HS) that has 18 parallel minichannels was developed on the aluminum plate and charged with acetone. The experimental results demonstrated that the proposed MC-HS startup was successfully under a heat load ranging from 10 to 40 W in the vertical orientation. From the investigations, a MC-HS is found to be more effective for the thermal management of the electronic components than the conventional method. The thermal resistance of the MC-HS is 20–31% lower in comparison with the conventional plate-fin aluminum heat sink. It is shown that the MC-HS not only surpasses the conventional solution but also provides greater thermal management of the electronic components.

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Abbreviations

Bo:

Bond number, \({\frac{g\left(\rho l-\rho v\right){r}_{h}}{\sigma }}^{2}\)

g:

Gravitational force, m/s2

\({\rho }_{l}\) :

Liquid density, kg/m3

\({\rho }_{v}\) :

Vapor density, kg/m3

\({r}_{h}\) :

Hydraulic radius, mm

\(\sigma\) :

Surface tension, N/m

Q :

Heat load, W

R th :

Thermal Resistance, °C/W

U :

Internal energy, J

T :

Temperature, °C

CLFP-OHP:

Closed-loop flat plate oscillating heat pipe

FP-OHP:

Flat plate oscillating heat pipe

MC-HS:

Minichannel heat sink

E:

Evaporator

C:

Condenser

L:

Liquid

V:

Vapor

W:

Watt

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Funding

All authors certify that they have no affiliations with or involvement in any organization or entity with any financial interest or non-financial interest in the subject matter or materials discussed in this manuscript. This article was funded by Student Start-up and Innovation Policy (SSIP), 201921003211, Kamlesh Mehta

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Authors and Affiliations

  1. Department of Mechanical Engineering, Gujarat Technological University, Ahmedabad, Gujarat, 382424, India

    Kamlesh Mehta

  2. Division of Welding Technology, University West, 46186, Trollhattan, Sweden

    Vivek Patel

  3. Northwestern Polytechnical University, Shaanxi, China

    Vivek Patel

  4. Department of Mechanical Engineering, Government Engineering College, Dahod, Gujarat, 389151, India

    Nirvesh Mehta

  5. Department of Mechanical Engineering, Navrachna University, Vadodara, Gujarat, India

    Amarish Badgujur

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  1. Kamlesh Mehta
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  2. Vivek Patel
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  3. Nirvesh Mehta
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Correspondence to Kamlesh Mehta.

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Mehta, K., Patel, V., Mehta, N. et al. Experimental Investigations of a Minichannel Heat Sink for Electronic Applications. Iran J Sci Technol Trans Mech Eng 47, 859–872 (2023). https://doi.org/10.1007/s40997-022-00559-0

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