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Metal-ion-tunable adhesive elastomers for mounting the multilayer elastic circuit

金属离子调控的高粘附弹性体用于组装多层弹性电路板

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Abstract

Multilayer elastic printed circuit boards (E-PCBs) have emerged as advanced configurations for integrating electronic components on elastomer substrates. However, weak inter-layer adhesion in elastic substrates can result in deformation-induced cracks and delamination in real-world applications. In this study, we present a novel approach to address this challenge by developing supramolecular sandwiched elastomers with high-adhesion skin and mechanically strong cores. This is achieved by precisely regulating the coordination bonds between different metal ions and the ethylenediamine groups within the aminated polydimethylsiloxane. The resulting sandwiched elastomer exhibits strong adhesion between layers (adhesion strength of 0.80 MPa), breaking strength of 0.81 MPa, Young’s modulus of 0.49 MPa, and maximum strain exceeding 500%. Leveraging these properties, the multilayered configuration of E-PCBs can be efficiently and securely assembled using the designed sandwiched elastomers through a simple layer-mounting method. This study offers a promising avenue for the simple and effective fabrication of mechanically stable multilayer flexible devices, eliminating the need for additional adhesive layers and complex structural constructions.

摘要

多层弹性印刷电路板被认为是在弹性基底上系统地集成各种电子元件的一种先进构造. 然而在实际应用中, 多层弹性基板之间的粘合界面很容易出现裂纹和分层, 这是层间粘附力较弱导致的. 在这里, 我们通过调节不同金属离子与侧链为乙二胺基团的聚二甲基硅氧烷之间的配位键, 得到了一种具有高粘附表皮和机械强韧内核的超分子复合夹层弹性体. 这种夹层弹性体可以实现层间的强粘附(粘附强度0.80 MPa), 同时兼具机械强度(断裂强度达0.81 MPa, 杨氏模量为0.48 MPa, 最大应变>500%). 通过分层组装策略, 此夹层弹性体可快速且牢固地组装具有多层结构的弹性电路板. 这项研究为简单高效地制备机械稳定的多层柔性器件提供了新的思路, 无需额外引入粘合层或者复杂的结构设计.

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Acknowledgements

This work was financially supported by the National Natural Science Foundation of China (22035008). We thank Yifan Wang and Xuanze Li from the EMPA characterization at the Institute of Process Engineering, Chinese Academy of Sciences, Beijing.

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Author notes

  1. These authors contributed equally to this work.

Authors and Affiliations

  1. Key Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190, China

    Peicheng Teng  (滕培成), Zhao Wang  (王曌), Yu Kang  (康煜), Yikai Zhang  (张益锴) & Shutao Wang  (王树涛)

  2. School of Future Technology, University of Chinese Academy of Sciences, Beijing, 100049, China

    Peicheng Teng  (滕培成), Zhao Wang  (王曌), Yu Kang  (康煜), Yikai Zhang  (张益锴) & Shutao Wang  (王树涛)

Authors
  1. Peicheng Teng  (滕培成)
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  2. Zhao Wang  (王曌)
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  3. Yu Kang  (康煜)
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  4. Yikai Zhang  (张益锴)
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  5. Shutao Wang  (王树涛)
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Contributions

Author contributions Wang Z and Wang S designed and engineered the samples; Teng P and Wang Z conceived the sandwiched structure; Teng P, Wang Z, Kang Y and Zhang Y performed the experiments; Teng P wrote the paper with support from Wang Z and Wang S. All authors contributed to the general discussion.

Corresponding author

Correspondence to Shutao Wang  (王树涛).

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Conflict of interest The authors declare that they have no conflict of interest.

Additional information

Peicheng Teng received his Bachelor’s degree from Northeast Normal University in 2017. Now he is a doctoral candidate at the Technical Institute of Physics and Chemistry (TIPC), Chinese Academy of Sciences. His research interest focuses on the design and fabrication of the interfacial connection of flexible electronic devices.

Zhao Wang received her PhD degree from the TIPC, Chinese Academy of Sciences at 2022. Now she is a post doctor at the TIPC. Her research interest focuses on the design and synthesis of smart adhesives and their practical applications.

Shutao Wang received his PhD degree from the Institute of Chemistry, Chinese Academy of Sciences in 2007. Now he is a full professor at the TIPC. His research interest focuses on the design of multi-scale adhesive interface.

Supplementary information Supporting data are available in the online version of the paper.

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Teng, P., Wang, Z., Kang, Y. et al. Metal-ion-tunable adhesive elastomers for mounting the multilayer elastic circuit. Sci. China Mater. 66, 4054–4061 (2023). https://doi.org/10.1007/s40843-023-2577-x

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  • DOI: https://doi.org/10.1007/s40843-023-2577-x

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