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A Full-Field Non-Contact Thermal Modal Testing Technique Under Ambient Excitation

  • S.I. : Computer Vision and Scanning Laser Vibrometry Methods
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Abstract

Temperature has significant effects on modal parameters of a structure. However, it is difficult to do a full-field dynamic measurement and identify modal parameters of the structure under high temperature and working conditions. In this work, three-dimensional digital image correlation combined with Bayesian operational modal analysis is used to yield a full-field non-contact thermal modal testing technique under ambient excitation. Thermal modal verification experiments are carried out on a titanium plate with free boundary conditions under ambient excitation by a low-cost high-temperature dynamic measurement system. Natural frequencies and mode shapes of the plate under different average high temperatures are studied in detail. From the experimental process, it is believed that the thermal modal testing technique proposed in this work is an effective alternative testing technique to traditional contact testing techniques, and after some improvements, one can achieve thermal modal analysis of a structure under high temperature and working conditions.

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Acknowledgements

The authors would like to thank the financial support from the National Science Foundation (Award No. 1763024), and National Natural Science Foundation of China (Award Nos. 11772100 and 51975379).

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Authors and Affiliations

  1. School of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai, 200093, China

    Y. J. Hu, Z. S. Huang & H. L. Li

  2. Department of Mechanical Engineering, University of Maryland, Baltimore County, 1000 Hilltop Circle, Baltimore, MD, 21250, USA

    W. D. Zhu

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  1. Y. J. Hu
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  2. Z. S. Huang
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  3. W. D. Zhu
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  4. H. L. Li
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Correspondence to W. D. Zhu.

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Hu, Y.J., Huang, Z.S., Zhu, W.D. et al. A Full-Field Non-Contact Thermal Modal Testing Technique Under Ambient Excitation. Exp Tech 45, 257–271 (2021). https://doi.org/10.1007/s40799-021-00441-9

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  • DOI: https://doi.org/10.1007/s40799-021-00441-9

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