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Thermal Stress Measurement of a Double Ring Structure Using Digital Image Correlation Method

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Abstract

Structures under a wide range of temperatures have been challenged by thermal problems. In order to assess the safety of structures in a thermal environment, thermal deformation and stress of structures should be determined by analysis and/or experimental method. This article presents a measurement method of the thermal deformation and stress of a double ring structure, which uses the digital image correlation method (DIC). The stress distribution of the double ring was obtained using a two-dimensional stress–strain relation. Efforts to remove measurement noise in the calculation of strain and stress are explained in detail. In order to verify the proposed measurementmethod, a finite element analysis of the double ring structure was performed using ABAQUS software. The results of DIC-based measurement and finite element analysis were found to be in good agreement.

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Author notes

  1. S. H. Lee

    Present address: Agency for Defense Development, Deajeon, Korea

Authors and Affiliations

  1. Smart Microsystem Research Laboratory, Department of Advanced Technology Fusion, Konkuk University, Seoul, South Korea

    T. L. Jin, S. H. Lee & N. S. Goo

Authors
  1. T. L. Jin
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  2. S. H. Lee
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  3. N. S. Goo
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Correspondence to S. H. Lee.

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Jin, T.L., Lee, S.H. & Goo, N.S. Thermal Stress Measurement of a Double Ring Structure Using Digital Image Correlation Method. Exp Tech 40, 195–205 (2016). https://doi.org/10.1007/s40799-016-0022-z

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  • DOI: https://doi.org/10.1007/s40799-016-0022-z

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