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Flexibility Enhancements of Hybrid Copper Inks with Cellulose Nanocrystals

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Abstract

Increasingly, copper nanopowders are commonly used in conductive inks due to their cost-efficiency compared to silver or gold and excellent electrical conductivity. One of the challenges associated with copper inks is oxidation and to address, we have developed a hybrid copper-based ink by removing the oxide layer of copper powders and coat the powders with a silver shell to protect from oxidation. Despite the advances, the inks are prone to fatigue failures when the ink films are repeatedly bent or stretched. In order to overcome this challenge, we proposed to integrate cellulose nanocrystals (CNC) with the copper-based ink on a polymer substrate and use a sintering process based on intense pulsed light in an argon atmosphere. Sintering in argon gas environment improved in electrical conductivity that may be the result of the partial carbonization of the CNC rather than combustion. It has also been experimentally determined that CNC improved adhesion strength of the copper ink film. Moreover, the addition of CNC also reduced the damage caused by bending and stretching. The ink film containing 10% CNC increased the electrical resistance by only 3.82 times after 600 bending cycles versus the resistance increased by 34.4 times without CNC. Under the 30% strain of stretching, the change in resistance of the ink film containing 10% CNC was 1.75 times lower than without CNC. It was observed through microscopy techniques that the presence of CNC reduced the formation of cracks by enhancing mechanical strength.

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References

  1. Hwang, H. J., Chung, W. H., & Kim, H. S. (2012). In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics. Nanotechnology, 23(48), 485205.

    Article  Google Scholar 

  2. Zhao, D., Liu, T., Park, J. G., et al. (2012). Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes. Microelectronic Engineering, 96, 71–75.

    Article  Google Scholar 

  3. Li, L. H., Mo, L. X., Ran, J., et al. (2014). Conductive ink and its application technology progress. Imaging Science and Photochemistry, 32, 393–401.

    Google Scholar 

  4. Das, R., & Harrop, P. (2009). Printed, organic & flexible electronics: forecasts, players & opportunities 2009–2029. Cambridge: IDTechEx.

    Google Scholar 

  5. Wang, X., Guo, W., Zhu, Y., et al. (2018). Electrical and mechanical properties of ink printed composite electrodes on plastic substrates. Applied Sciences, 8(11), 2101.

    Article  Google Scholar 

  6. Yim, C., Kockerbeck, Z. A., Jo, S. B., et al. (2017). Hybrid copper–silver–graphene nanoplatelet conductive inks on pdms for oxidation resistance under intensive pulsed light. ACS Applied Materials & Interfaces, 9(42), 37160–37165.

    Article  Google Scholar 

  7. Joo, S. J., Park, S. H., Moon, C. J., et al. (2015). A highly reliable copper nanowire/nanoparticle ink pattern with high conductivity on flexible substrate prepared via a flash light-sintering technique. ACS Applied Materials & Interfaces, 7(10), 5674–5684.

    Article  Google Scholar 

  8. Liu, Z., Su, Y., & Varahramyan, K. (2005). Inkjet-printed silver conductors using silver nitrate ink and their electrical contacts with conducting polymers. Thin Solid Films, 478(1–2), 275–279.

    Article  Google Scholar 

  9. Woo, K., Kim, D., Kim, J. S., et al. (2009). Ink-Jet printing of Cu−Ag-based highly conductive tracks on a transparent substrate. Langmuir, 25(1), 429–433.

    Article  Google Scholar 

  10. Kang, J. S., Ryu, J., Kim, H. S., et al. (2011). Sintering of inkjet-printed silver nanoparticles at room temperature using intense pulsed light. Journal of Electronic Materials, 40(11), 2268.

    Article  Google Scholar 

  11. Lee, D. J., Park, S. H., Jang, S., et al. (2011). Pulsed light sintering characteristics of inkjet-printed nanosilver films on a polymer substrate. Journal of Micromechanics and Microengineering, 21(12), 125023.

    Article  Google Scholar 

  12. Kim, Y., Lee, B., Yang, S., et al. (2012). Use of copper ink for fabricating conductive electrodes and RFID antenna tags by screen printing. Current Applied Physics, 12(2), 473–478.

    Article  Google Scholar 

  13. Wang, B. Y., Yoo, T. H., Song, Y. W., et al. (2013). Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering. ACS Applied Materials & Interfaces, 5(10), 4113–4119.

    Article  Google Scholar 

  14. Zenou, M., Ermak, O., Saar, A., et al. (2013). Laser sintering of copper nanoparticles. Journal of Physics D: Applied Physics, 47(2), 025501.

    Article  Google Scholar 

  15. Lee, J., Lee, B., Jeong, S., et al. (2014). Microstructure and electrical property of laser-sintered Cu complex ink. Applied Surface Science, 307, 42–45.

    Article  Google Scholar 

  16. Yim, C., Sandwell, A., & Park, S. S. (2016). Hybrid copper–silver conductive tracks for enhanced oxidation resistance under flash light sintering. ACS Applied Materials & Interfaces, 8(34), 22369–22373.

    Article  Google Scholar 

  17. Kim, I., Kim, Y., Woo, K., et al. (2013). Synthesis of oxidation-resistant core–shell copper nanoparticles. Rsc Advances, 3(35), 15169–15177.

    Article  Google Scholar 

  18. Grouchko, M., Kamyshny, A., & Magdassi, S. (2009). Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing. Journal of Materials Chemistry, 19(19), 3057–3062.

    Article  Google Scholar 

  19. Sabo, R., Yermakov, A., Law, C. T., et al. (2016). Nanocellulose-enabled electronics, energy harvesting devices, smart materials and sensors: A review. Journal of Renewable Materials, 4(5), 297–312.

    Article  Google Scholar 

  20. Huang, K. M., Tsukamoto, H., Yong, Y., et al. (2017). Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns. RSC Advances, 7(40), 25095–25100.

    Article  Google Scholar 

  21. Liao, Y. C., & Kao, Z. K. (2012). Direct writing patterns for electroless plated copper thin film on plastic substrates. ACS Applied Materials & Interfaces, 4(10), 5109–5113.

    Article  Google Scholar 

  22. Park, S. I., Ahn, J. H., Feng, X., et al. (2008). Theoretical and experimental studies of bending of inorganic electronic materials on plastic substrates. Advanced Functional Materials, 18(18), 2673–2684.

    Article  Google Scholar 

  23. López-Delgado, A., Cano, E., Bastidas, J. M., et al. (2001). A comparative study on copper corrosion originated by formic and acetic acid vapours. Journal of Materials Science, 36(21), 5203–5211.

    Article  Google Scholar 

  24. Bastidas, D. M., La Iglesia, V. M., Cano, E., et al. (2008). Kinetic study of formate compounds developed on copper in the presence of formic acid vapor. Journal of The Electrochemical Society, 155(12), C578.

    Article  Google Scholar 

  25. Gong, J., Li, J., Xu, J., et al. (2017). Research on cellulose nanocrystals produced from cellulose sources with various polymorphs. RSC Advances, 7(53), 33486–33493.

    Article  Google Scholar 

  26. Eun, K., Chon, M. W., Yoo, T. H., Song, Y. W., & Choa, S. H. (2015). Electromechanical properties of printed copper ink film using a white flash light annealing process for flexible electronics. Microelectronics Reliability, 55(5), 838–845.

    Article  Google Scholar 

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Funding

The authors would like to acknowledge the funding and support from Alberta Innovates CNC Challenge 3.0.

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Correspondence to Simon S. Park.

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Liu, L., Wong, D., Lee, J. et al. Flexibility Enhancements of Hybrid Copper Inks with Cellulose Nanocrystals. Int. J. of Precis. Eng. and Manuf.-Green Tech. 8, 1755–1766 (2021). https://doi.org/10.1007/s40684-020-00278-4

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  • DOI: https://doi.org/10.1007/s40684-020-00278-4

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