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An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films (NMFs) adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be ~5.0 J/m2 for Cu/Cr, ~4.1 J/m2 for Cu/Ta, ~2.8 J/m2 for Cu/Mo, ~1.1 J/m2 for Cu/Nb, and ~1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.

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Acknowledgments

This work was financially supported by the National Natural Science Foundation of China (Nos. 51321003, 51322104, 51201123 and 51571157), the National Basic Research Program of China (No. 2010CB631003), and the 111 Project of China (No. B06025). Gang Liu thanks the support from Fundamental Research Funds for the Central Universities and Tengfei Scholar project. Jin-Yu Zhang thanks China Postdoctoral Science Foundation (No. 2012M521765) and Shaanxi Province Postdoctoral Scientific Research Projects for part of financial support.

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Authors and Affiliations

  1. State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an, 710049, China

    Kai Wu, Jin-Yu Zhang, Gang Liu, Jiao Li & Jun Sun

  2. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, 710048, China

    Guo-Jun Zhang

Authors
  1. Kai Wu
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  2. Jin-Yu Zhang
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  3. Gang Liu
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  4. Jiao Li
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  5. Guo-Jun Zhang
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  6. Jun Sun
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Corresponding authors

Correspondence to Gang Liu or Jun Sun.

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Available online at http://link.springer.com/journal/40195

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Wu, K., Zhang, JY., Liu, G. et al. An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates. Acta Metall. Sin. (Engl. Lett.) 29, 181–187 (2016). https://doi.org/10.1007/s40195-016-0375-4

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  • DOI: https://doi.org/10.1007/s40195-016-0375-4

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