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Microstructures and Tensile Properties of Ultrafine-Grained Ni–(1–3.5) wt% SiCNP Composites Prepared by a Powder Metallurgy Route

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

Silicon carbide nanoparticle-reinforced nickel-based composites (Ni–SiCNP), with a SiCNP content ranged from 1 to 3.5 wt%, were prepared using mechanical alloying and spark plasma sintering. In addition, unreinforced pure nickel samples were also prepared for comparative purposes. To characterize the microstructural properties of both the unreinforced pure nickel and the Ni–SiCNP composites transmission electron microscopy (TEM) was used, while their mechanical behavior was investigated using the Vickers pyramid method for hardness measurements and a universal tensile testing machine for tensile tests. TEM results showed an array of dislocation lines decorated in the sintered pure nickel sample, whereas, for the Ni–SiCNP composites, the presence of nano-dispersed SiCNP and twinning crystals was observed. These homogeneously distributed SiCNP were found located either within the matrix, between twins or on grain boundaries. For the Ni–SiCNP composites, coerced coarsening of the SiCNP assembly occurred with increasing SiCNP content. Furthermore, the grain sizes of the Ni–SiCNP composites were much finer than that of the unreinforced pure nickel, which was considered to be due to the composite ball milling process. In all cases, the Ni–SiCNP composites showed higher strengths and hardness values than the unreinforced pure nickel, likely due to a combination of dispersion strengthening (Orowan effects) and particle strengthening (Hall–Petch effects). For the Ni–SiCNP composites, the strength increased initially and then decreased as a function of SiCNP content, whereas their elongation percentages decreased linearly. Compared to all materials tested, the Ni–SiCNP composite containing 1.5% SiC was found more superior considering both their strength and plastic properties.

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Acknowledgments

This research was supported by the China-Australia Joint Research Project (Grant No. 2014DFG60230), Knowledge Innovation program of Chinese Academy of Sciences and National Basic Research Program of China (Grant No. 2010CB832903 and 2010CB834503). The authors are grateful to “Shanghai Key Laboratory for High Temperature Materials and Precision Forming” for materials preparation by providing the SPS furnace.

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Authors and Affiliations

  1. Shanghai Institute of Applied Physics, Chinese Academy of Science (CAS), 2019 Jialuo Road, Jiading District, Shanghai, 201800, China

    Chao Yang, He-Fei Huang, Long Yan & Xing-Tai Zhou

  2. Institute of Materials Engineering, Australian Nuclear Science and Technology Organisation, Lucas Heights, NSW, 2234, Australia

    Massey de los Reyes

  3. State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai, 200240, China

    Tian Xia & De-Liang Zhang

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  1. Chao Yang
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  2. He-Fei Huang
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  3. Massey de los Reyes
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  4. Long Yan
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  5. Xing-Tai Zhou
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  6. Tian Xia
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  7. De-Liang Zhang
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Correspondence to He-Fei Huang or Xing-Tai Zhou.

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Yang, C., Huang, HF., de los Reyes, M. et al. Microstructures and Tensile Properties of Ultrafine-Grained Ni–(1–3.5) wt% SiCNP Composites Prepared by a Powder Metallurgy Route. Acta Metall. Sin. (Engl. Lett.) 28, 809–816 (2015). https://doi.org/10.1007/s40195-015-0261-5

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  • DOI: https://doi.org/10.1007/s40195-015-0261-5

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