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Effect of H2 Reduction Temperature on the Properties of Reduced Graphene Oxide and Copper Matrix Composites

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Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

Reduced graphene oxide (RGO) and copper composites (RGO/Cu) were successfully fabricated based on a molecular-level mixing method (MLM). The composite powders were reduced in H2 at 350, 450, and 550 °C and then consolidated by spark plasma sintering (SPS) in order to evaluate the effect of H2 reduction temperature on the properties of the composites. The results indicate that the strengths of the composite decrease with the increase of H2 reduction temperature, while the electrical conductivity reaches its maximum at 450 °C and minimum at 550 °C. Hot rolling could benefit the electrical conductivity. The yield strength of the RGO/Cu composite reduced to 337 MPa at 350 °C. The electrical conductivity of the RGO/Cu composite reduced at 450 °C after hot rolling reaches 60.26% IACS. The properties of the RGO/Cu composites can be designed by adjusting the reduction degree of RGO and by hot rolling.

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Acknowledgments

This work was financially supported by the National Basic Research Program of China (No. 2011CB612200), Program of Qinghai Science and Technology Department (No. 2012-Z-701) and Harbin Key Technologies R&D Program (No. 2012DB2CP029).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin, 150001, China

    Lidong Wang, Ye Cui, Bin Li & Weidong Fei

  2. Shanghai Institute of Space Power-Sources, Shanghai, 200245, China

    Ruiyu Li

  3. School of Materials Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, China

    Guojian Cao

  4. School of Mechanical Engineering, Qinghai University, Xining, 810016, China

    Weidong Fei

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  1. Lidong Wang
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  2. Ye Cui
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Correspondence to Weidong Fei.

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Wang, L., Cui, Y., Li, R. et al. Effect of H2 Reduction Temperature on the Properties of Reduced Graphene Oxide and Copper Matrix Composites. Acta Metall. Sin. (Engl. Lett.) 27, 924–929 (2014). https://doi.org/10.1007/s40195-014-0146-z

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  • DOI: https://doi.org/10.1007/s40195-014-0146-z

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